参数资料
型号: NCV8537MN500GEVB
厂商: ON Semiconductor
文件页数: 4/16页
文件大小: 0K
描述: BOARD EVALUATION NCV8537 5.0V
设计资源: NCV8537 Schematic
NCV8537 BOM
NCV8537MN500GEVB Gerber Files
标准包装: 1
每 IC 通道数: 1 - 单
输出电压: 5V
电流 - 输出: 500mA
输入电压: 2.9 V ~ 12 V
稳压器类型: 正,固定式
工作温度: -40°C ~ 125°C
板类型: 完全填充
已供物品:
已用 IC / 零件: NCV8537
其它名称: NCV8537MN500GEVBOS
NCV8537
PIN FUNCTION DESCRIPTION
Pin No.
1, 2
3
4
5
6
7
8
9, 10
EPAD
Pin Name
V out
SENSE/ADJ
GND
PWRG
NC
NR
SD
V in
EPAD
Description
Regulated output voltage. Bypass to ground with C out w 1.0 m F
For output voltage sensing, connect to Pins 1 and 2.at Fixed output Voltage version
Adjustable pin at Adjustable output version
Power Supply Ground
Power Good
Not Connected
Noise Reduction Pin. This is an optional pin used to further reduce noise.
Shutdown pin. When not in use, this pin should be connected to the input pin.
Power Supply Input Voltage
Exposed thermal pad should be connected to ground.
MAXIMUM RATINGS
Input Voltage
Output Voltage
PWRG Pin Voltage
Shutdown Pin Voltage
Junction Temperature Range
Storage Temperature Range
Rating
Symbol
V in
V out
V PWRG
V sh
T J
T stg
Value
? 0.3 to +16
? 0.3 to V in +0.3 or 10 V*
? 0.3 to +16
? 0.3 to +16
? 40 to +150
? 50 to +150
Unit
V
V
V
V
? C
? C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) tested per AEC ? Q100 ? 002 (EIA/JESD22 ? A114)
Machine Model (MM) tested per AEC ? Q100 ? 003 (EIA/JESD22 ? A115)
Charged Device Model (CDM) tested per EIA/JESD22 ? C101.
*Which ever is less. Reverse bias protection feature valid only if (V out ? V in ) ? 7 V.
THERMAL CHARACTERISTICS
Test Conditions (Typical Value)
Characteristic
Junction ? to ? Air, q JA
Junction ? to ? Pin, J ? L4
Min Pad Board (Note 1)
215
58
1 , Pad Board (Note 1)
66
18
Unit
? C/W
? C/W
1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and
heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions
are under natural convection or zero air flow.
http://onsemi.com
4
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