参数资料
| 型号： | NCV8702SN33T1G |
| 厂商： | ON Semiconductor |
| 文件页数： | 19/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V .2A SOT23-5 |
| 标准包装： | 3,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V |
| 输入电压： | 最高 5.5V |
| 电压 - 压降（标准）： | 0.14V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA |
| 电流 - 限制（最小）： | 220mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-TSSOP（5 引线），SC-88A，SOT-353 |
| 供应商设备封装： | 5-TSOP |
| 包装： | 带卷 (TR) |
NCV8702
PACKAGE DIMENSIONS
XDFN6 1.5x1.5, 0.5P
CASE 711AE
ISSUE A
D
A
B
L1
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
2X
PIN ONE
REFERENCE
0.10 C
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu MOLD CMPD
0.10 AND 0.20mm FROM TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.35 0.45
A1 0.00 0.05
A3 0.13 REF
b 0.20 0.30
D 1.50 BSC
E
1.50 BSC
2X
0.10 C
0.05 C
TOP VIEW
DETAIL B
A
A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
e
L
L1
L2
0.50 BSC
0.40 0.60
--- 0.15
0.50 0.70
A1
0.05 C
SIDE VIEW
C
SEATING
PLANE
RECOMMENDED
MOUNTING FOOTPRINT*
DETAIL A
1
3
e
5X
L
6X
0.35
5X
0.73
L2
1.80
6
4
6X
b
0.83
0.50
PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
0.10 C A B
0.05 C NOTE 3
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
19
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