参数资料
型号: NCV8800HDW26R2
厂商: ON Semiconductor
文件页数: 11/13页
文件大小: 0K
描述: IC REG BUCK SYNC 2.6V 1A 16SOIC
产品变化通告: Product Discontinuation 09/Jan/2008
标准包装: 1,000
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 2.6V
输入电压: 3.5 V ~ 16 V
PWM 型: 混合物
频率 - 开关: 200kHz
电流 - 输出: 1A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
包装: 带卷 (TR)
供应商设备封装: 16-SOIC W
NCV8800 Series
The major advantage of constant frequency operation is
that the component selections, especially the magnetic
component design, become very easy. Oscillator frequency
is fixed at 200 kHz.
Start--Up
After the NCV8800 is powered up, the error amplifier will
begin linearly charging the COMP pin capacitor. The COMP
capacitance and the source current of the error amplifier
determine the slew rate of COMP voltage. The output of the
error amplifier is connected internally to the inverting input
of the PWM comparator and it is compared with the divided
100
90
80
70
60
50
down output voltage FB1/FB2 at the non--inverting input of
the PWM comparator. At the beginning of each switching
cycle, the oscillator output will set the PWM latch. This
causes the high--side switch to turn on and the regulator
output voltage to ramp up.
When the divided down output voltage achieves a level set
40
0 0.5 1.0 1.5 2.0 2.5
Copper Area (inch 2 )
Figure 9. 16 Lead SOW (4 Leads Fused), θ JA as
a Function of the Pad Copper Area (2 oz. Cu.
Thickness), Board Material = 0.0625 ″ G--10/R--4
3.0
by the COMP voltage, the high--side switch will be turned
off. The V 2 control loop will adjust the high--side switch
duty cycle as required to ensure the regulator output voltage
tracks the COMP voltage. Since the COMP voltage
increases gradually, Soft Start can be achieved.
Overcurrent Protection
The output switch is protected on both the high side and
low side. Current limit is set at 1.0 A (min).
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of R θ JA :
R θ JA = R θ JC + R θ CS + R θ SA
(3)
where:
R θ JC = the junction--to--case thermal resistance,
R θ CS = the case--to--heatsink thermal resistance, and
R θ SA = the heatsink--to--ambient thermal resistance.
R θ JC appears in the package section of the data sheet. Like
R θ JA , it too is a function of package type. R θ CS and R θ SA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
http://onsemi.com
11
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