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参数资料
| 型号： | NCV8842DR2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/16页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK 1.5A 8SOIC |
| 标准包装： | 2,500 |
| 类型： | 降压（降压） |
| 输出数： | 1 |
| 输入电压： | 4.5 V ~ 40 V |
| PWM 型： | 混合物 |
| 频率 - 开关： | 170kHz |
| 电流 - 输出： | 1.5A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 8-SOICN |
NCV8842
PACKAGE PIN DESCRIPTION
SO ? 16W
PIN SYM-
SO ? 8
1
2
3
4
5
6
7
8
?
?
EPAD
15
16
1
2
7
8
9
10
3 ? 6,
11 ? 14
EPAD
DFN ? 18
1
2 ? 4
5 ? 7
8
10
13
16
17
9, 11, 12,
14, 15, 18
EPAD
BOL
BOOST
V IN
V SW
SHDNB
SYNC
GND
V FB
V C
NC
?
FUNCTION
The BOOST pin provides additional drive voltage to the on ? chip NPN power tran-
sistor. The resulting decrease in switch on voltage increases efficiency.
This pin is the main power input to the IC.
This is the connection to the emitter of the on ? chip NPN power transistor and
serves as the switch output to the inductor. This pin may be subjected to negative
voltages during switch off ? time. A catch diode is required to clamp the pin voltage
in normal operation. This node can stand ? 1.0 V for less than 50 ns during switch
node flyback.
The shutdown pin is active low and TTL compatible. The IC goes into sleep mode,
drawing less than 1.0 m A when the pin voltage is pulled below 1.0 V. This pin
should be pulled up to V CC with a resistor.
External synchronization single input, with 60k internal pull ? down resistor. If not
used, leave unconnected or connect to GND.
Power return connection for the IC.
The FB pin provides input to the inverting input of the error amplifier. If V FB is
lower than 0.29 V, the oscillator frequency is divided by four, and current limit folds
back to about 1 ampere. These features protect the IC under severe overcurrent
or short circuit conditions.
The V C pin provides a connection point to the output of the error amplifier and
input to the PWM comparator. Driving of this pin should be avoided because on ?
chip test circuitry becomes active whenever current exceeding 0.5 mA is forced
into the IC.
No Connection
Exposed die attach pad. Internally connected to GND. External connection to GND
is optional.
PIN CONNECTIONS
V SW
1
16
V IN
BOOST
V IN
V SW
SHDNB
1
8
V C
V FB
GND
SYNC
SHDNB
NC
NC
NC
NC
BOOST
NC
NC
NC
NC
BOOST
V IN
V IN
V IN
V SW
V SW
V SW
SHDNB
NC
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
NC
V C
V FB
NC
NC
GND
NC
NC
SYNC
SO ? 8
SYNC
GND
V C
V FB
DFN ? 18
SO ? 16W EPAD
http://onsemi.com
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