参数资料
型号: NL17SZ17DFT2G
厂商: ON Semiconductor
文件页数: 5/7页
文件大小: 0K
描述: IC BUFF SCHMT TRG N-INV SOT353
产品变化通告: Wire Change for SC88/A 17/Jun/2011
标准包装: 1
系列: 17SZ
逻辑类型: 施密特触发器 - 缓冲器,驱动器
元件数: 1
每个元件的位元数: 1
输出电流高,低: 32mA,32mA
电源电压: 1.65 V ~ 5.5 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-TSSOP(5 引线),SC-88A,SOT-353
供应商设备封装: SC-70
包装: 标准包装
产品目录页面: 1126 (CN2011-ZH PDF)
其它名称: NL17SZ17DFT2GOSDKR
NL17SZ17
http://onsemi.com
5
DEVICE ORDERING INFORMATION
Device Order
Number
Package
Type
Tape/Reel Size
NL17SZ17DFT2G
SC88A/SC705/SOT353
(PbFree)
3000 Units / Tape & Reel
NLV17SZ17DFT2G*
SC88A/SC705/SOT353
(PbFree)
3000 Units / Tape & Reel
NL17SZ17XV5T2G
SOT553
(PbFree)
4000 Units / Tape & Reel
NL17SZ17P5T5G
SOT953
(PbFree)
8000 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable.
PACKAGE DIMENSIONS
SOT553
XV5 SUFFIX
CASE 463B
ISSUE B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.35
0.0531
0.5
0.0197
mm
inches
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
e
M
0.08 (0.003)
X
b 5 PL
A
c
X
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
D
E
Y
12
3
4
5
L
HE
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
0.50
0.55
0.60
0.020
INCHES
b
0.17
0.22
0.27
0.007
c
D
1.50
1.60
1.70
0.059
E
1.10
1.20
1.30
0.043
e
0.50 BSC
L
0.10
0.20
0.30
0.004
0.022
0.024
0.009
0.011
0.063
0.067
0.047
0.051
0.008
0.012
NOM
MAX
1.50
1.60
1.70
0.059
0.063
0.067
HE
0.08
0.13
0.18
0.003
0.005
0.007
0.020 BSC
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