参数资料
型号: NLAS4599DFT2
厂商: ON Semiconductor
文件页数: 4/11页
文件大小: 0K
描述: IC SWITCH SPDT SC88
产品变化通告: LTB Notification 03/Jan/2008
标准包装: 1
功能: 开关
电路: 1 x SPDT
导通状态电阻: 30 欧姆
电压电源: 单电源
电压 - 电源,单路/双路(±): 2 V ~ 5.5 V
电流 - 电源: 1µA
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-88
包装: 剪切带 (CT)
其它名称: NLAS4599DFT2OSCT
NLAS4599
http://onsemi.com
2
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
Positive DC Supply Voltage
0.5 to +7.0
V
VIS
Analog Input Voltage (VNO or VCOM)
0.5 ≤ VIS ≤ VCC )0.5
V
VIN
Digital Select Input Voltage
0.5 ≤ VI ≤ + 7.0
V
IIK
DC Current, Into or Out of Any Pin
$50
mA
PD
Power Dissipation in Still Air
SC88
TSOP6
200
mW
TSTG
Storage Temperature Range
65 to +150
°C
TL
Lead Temperature, 1mm from Case for 10 seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
VESD
ESD Withstand Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
2000
200
N/A
V
ILATCHUP
LatchUp Performance
Above VCC and Below GND at 125°C (Note 4)
$300
mA
qJA
Thermal Resistance
SC88
TSOP6
333
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22A114A
2. Tested to EIA/JESD22A115A
3. Tested to JESD22C101A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
DC Supply Voltage
2.0
5.5
V
VIN
Digital Select Input Voltage
GND
5.5
V
VIS
Analog Input Voltage (NC, NO, COM)
GND
VCC
V
TA
Operating Temperature Range
55
+125
°C
tr, tf
Input Rise or Fall Time,
SELECT
VCC = 3.3 V + 0.3 V
VCC = 5.0 V + 0.5 V
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME
TO 0.1% BOND FAILURES
Junction
Temperature 5C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
10
100
1000
TIME, YEARS
NORMALIZED
F
AILURE
RA
TE
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
T
J=
130
°C
T
J=
1
10
°C
T
J=
100
°C
T
J=
90
°C
T
J=
80
°C
T
J=
120
°C
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