参数资料
型号: NLX1G74MUTCG
厂商: ON Semiconductor
文件页数: 6/6页
文件大小: 0K
描述: IC FLIP FLOP SGL D 8-UQFN
标准包装: 3,000
功能: 设置(预设)和复位
类型: D 型
输出类型: 差分
元件数: 1
每个元件的位元数: 1
频率 - 时钟: 250MHz
延迟时间 - 传输: 2.2ns
触发器类型: 正边沿
输出电流高,低: 32mA,32mA
电源电压: 1.65 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-UFQFN
包装: 带卷 (TR)
NLX1G74
http://onsemi.com
6
PACKAGE DIMENSIONS
UQFN8
MU SUFFIX
CASE 523AN
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10
B
0.05
A
C
C NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
A
A1
(A3)
0.05 C
C SEATING
PLANE
SIDE VIEW
L
8X
1
3
5
8
DIM MIN
MAX
MILLIMETERS
A
0.45
0.60
A1
0.00
0.05
A3
0.13 REF
b
0.15
0.25
D
1.60 BSC
L1
0.15
E
1.60 BSC
e
0.50 BSC
L
0.35
0.45
L1
DETAIL A
A1
A3
DETAIL B
OPTIONAL
MOLD CMPD
EXPOSED Cu
b
CONSTRUCTION
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
0.35
7X
DIMENSIONS: MILLIMETERS
1
7
L3
0.25
1.70
0.50
L3
0.25
0.35
L3
(0.10)
(0.15)
8X
0.53
8X
0.53
8X
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