参数资料
| 型号： | NLX2G32CMX1TCG |
| 厂商： | ON Semiconductor |
| 文件页数： | 10/10页 |
| 文件大小： | 0K |
| 描述： | IC GATE OR DUAL 2INP 8ULLGA |
| 标准包装： | 3,000 |
| 逻辑类型： | 或门 |
| 电路数： | 2 |
| 输入数： | 2 |
| 电源电压： | 1.65 V ~ 5.5 V |
| 电流 - 静态（最大值）： | 1µA |
| 输出电流高，低： | 32mA，32mA |
| 额定电压和最大 CL 时的最大传播延迟： | 3.7ns @ 4.5V ~ 5.5V，50pF |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 8-ULLGA（1.45x1） |
| 封装/外壳： | 8-XFLGA |
| 包装： | 带卷 (TR) |
NLX2G32
http://onsemi.com
9
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P
CASE 613AB
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10
B
0.05
A
C
L
7X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
8X
A
A1
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
1
4
5
8
DIM MIN
MAX
MILLIMETERS
A
0.40
A1
0.00
0.05
b
0.15
0.25
D
1.60 BSC
E
1.00 BSC
e
0.40 BSC
L
0.25
0.35
L1
0.30
0.40
e/2
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.26
7X
0.49
8X
1.24
0.53
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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