参数资料
型号: NTB6410ANT4G
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 100V 76A D2PAK
标准包装: 800
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 76A
开态Rds(最大)@ Id, Vgs @ 25° C: 13 毫欧 @ 76A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 120nC @ 10V
输入电容 (Ciss) @ Vds: 4500pF @ 25V
功率 - 最大: 188W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 带卷 (TR)
NTB6410AN, NTP6410AN,
NVB6410AN
N-Channel Power MOSFET
100 V, 76 A, 13 m W
Features
? Low R DS(on)
? High Current Capability
? 100% Avalanche Tested
? NVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC ? Q101
Qualified and PPAP Capable
?
These Devices are Pb ? Free and are RoHS Compliant
V (BR)DSS
100 V
http://onsemi.com
R DS(ON) MAX
13 m W @ 10 V
N ? Channel
I D MAX
(Note 1)
76 A
D
MAXIMUM RATINGS (T J = 25 ° C Unless otherwise specified)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
V DSS
V GS
100
$ 20
V
V
G
Continuous Drain
Current R q JC
Power Dissipation
R q JC
Steady
State
Steady
State
T C = 25 ° C
T C = 100 ° C
T C = 25 ° C
I D
P D
76
54
188
A
W
4
S
4
Pulsed Drain Current
t p = 10 m s
I DM
305
A
1
2
Operating Junction and Storage Temperature
Range
T J , T stg
? 55 to
+175
° C
TO ? 220AB
3
D 2 PAK
Drain
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 50 Vdc, V GS = 10 Vdc,
I L(pk) = 57.7 A, L = 0.3 mH, R G = 25 W )
Lead Temperature for Soldering
Purposes, 1/8 ″ from Case for 10 Seconds
THERMAL RESISTANCE RATINGS
I S
E AS
T L
76
500
260
A
mJ
° C
1
2
3
4
CASE 221A CASE 418B
STYLE 5 STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
Parameter
Symbol
Max
Unit
3
1
3
Source
Gate
Source
Junction ? to ? Case (Drain) Steady State R q JC 0.8 ° C/W
Junction ? to ? Ambient (Note 1) R q JA 32
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
1
Gate
NTP
6410ANG
AYWW
2
Drain
NTB
6410ANG
AYWW
2
Drain
6410AN = Specific Device Code
G = Pb ? Free Device
A = Assembly Location
Y = Year
WW = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2012
January, 2012 ? Rev. 1
1
Publication Order Number:
NTB6410AN/D
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