参数资料
型号: NTD3813N-35G
厂商: ON Semiconductor
文件页数: 2/8页
文件大小: 0K
描述: MOSFET N-CH 16V 9.6A IPAK
产品变化通告: Product Obsolescence 19/Dec/2008
标准包装: 75
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 16V
电流 - 连续漏极(Id) @ 25° C: 9.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 8.75 毫欧 @ 15A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 12.8nC @ 4.5V
输入电容 (Ciss) @ Vds: 963pF @ 12V
功率 - 最大: 1.2W
安装类型: 通孔
封装/外壳: TO-251-3 短截引线,IPak
供应商设备封装: I-Pak
包装: 管件
NTD3813N
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Junction-to-Case (Drain)
Junction-to-TAB (Drain)
Junction-to-Ambient – Steady State (Note 1)
Junction-to-Ambient – Steady State (Note 2)
Symbol
R q JC
R q JC-TAB
R q JA
R q JA
Value
4.3
3.6
58
121
Unit
° C/W
1. Surface-mounted on FR4 board using 1 sq-in pad, 1 oz Cu.
2. Surface-mounted on FR4 board using the minimum recommended pad size.
ELECTRICAL CHARACTERISTICS (T J = 25 ° C unless otherwise specified)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain-to-Source Breakdown Voltage
Drain-to-Source Breakdown Voltage
Temperature Coefficient
V (BR)DSS
V (BR)DSS /
T J
V GS = 0 V, I D = 250 m A
16
16.8
V
mV/ ° C
Zero Gate Voltage Drain Current
I DSS
V GS = 0 V,
V DS = 16 V
T J = 25 ° C
T J = 125 ° C
1.0
10
m A
Gate-to-Source Leakage Current
I GSS
V DS = 0 V, V GS = ± 16 V
± 100
nA
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage
Negative Threshold Temperature
Coefficient
V GS(TH)
V GS(TH) /T J
V GS = V DS , I D = 250 m A
1.5
5.3
2.5
V
mV/ ° C
Drain-to-Source On Resistance
R DS(on)
V GS = 10 V
V GS = 4.5 V
I D = 15 A
I D = 15 A
7.2
11
8.75
14.5
m W
Forward Transconductance
g FS
V DS = 1.5 V, I D = 15 A
40
S
CHARGES AND CAPACITANCES
Input Capacitance
C ISS
963
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Threshold Gate Charge
Gate-to-Source Charge
Gate-to-Drain Charge
Total Gate Charge
C OSS
C RSS
Q G(TOT)
Q G(TH)
Q GS
Q GD
Q G(TOT)
V GS = 0 V, f = 1.0 MHz, V DS = 12 V
V GS = 4.5 V, V DS = 12 V, I D = 15 A
V GS = 10 V, V DS = 12 V, I D = 15 A
338
191
8.5
0.93
3.1
3.8
16.7
12.8
pF
nC
nC
SWITCHING CHARACTERISTICS (Note 4)
Turn-On Delay Time
t d(ON)
12
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
t r
t d(OFF)
t f
t d(ON)
t r
t d(OFF)
t f
V GS = 4.5 V, V DS = 12 V,
I D = 15 A, R G = 3.0 W
V GS = 10 V, V DS = 12 V,
I D = 15 A, R G = 3.0 W
38
14
5.0
8.0
33
20
8.0
ns
ns
3. Pulse Test: pulse width v 300 m s, duty cycle v 2%.
4. Switching characteristics are independent of operating junction temperatures.
5. Assume standoff of 110 mm.
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