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参数资料
| 型号： | NTD40N03RT4G |
| 厂商： | ON Semiconductor |
| 文件页数： | 1/7页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 25V 7.8A DPAK |
| 产品变化通告： | Product Discontinuation 30/Sept/2011 |
| 标准包装： | 1 |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 25V |
| 电流 - 连续漏极(Id) @ 25° C： | 7.8A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 16.5 毫欧 @ 10A，10V |
| Id 时的 Vgs(th)（最大）： | 2V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 5.78nC @ 4.5V |
| 输入电容 (Ciss) @ Vds： | 584pF @ 20V |
| 功率 - 最大： | 1.5W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-252-3，DPak（2 引线+接片），SC-63 |
| 供应商设备封装： | D-Pak |
| 包装： | 标准包装 |
| 其它名称： | NTD40N03RT4GOSDKR |
NTD40N03R
Power MOSFET
45 A, 25 V, N ? Channel DPAK
Features
?
Planar HD3e Process for Fast Switching Performance
?
?
?
?
?
Low R DS(on) to Minimize Conduction Loss
Low C iss to Minimize Driver Loss
Low Gate Charge
Optimized for High Side Switching Requirements in
High ? Efficiency DC ? DC Converters
These are Pb ? Free Devices
http://onsemi.com
45 AMPERES, 25 VOLTS
R DS(on) = 12.6 m W (Typ)
N ? CHANNEL
MAXIMUM RATINGS (T J = 25 ° C unless otherwise specified)
D
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
V DSS
V GS
25
± 20
Vdc
Vdc
G
Thermal Resistance ? Junction ? to ? Case
Total Power Dissipation @ T C = 25 ° C
Drain Current
? Continuous @ T C = 25 ° C, Chip
? Continuous @ T A = 25 ° C, Limited by Wires
? Single Pulse (tp ≤ 10 m s)
R q JC
P D
I D
I D
I D
3.0
50
45
32
100
° C/W
W
A
A
A
4
S
4
Thermal Resistance ? Junction ? to ? Ambient
(Note 1)
? Total Power Dissipation @ T A = 25 ° C
? Drain Current ? Continuous @ T A = 25 ° C
R q JA
P D
I D
71.4
2.1
9.2
° C/W
W
A
1 2
3
1
2
3
Thermal Resistance ? Junction ? to ? Ambient
(Note 2)
? Total Power Dissipation @ T A = 25 ° C
? Drain Current ? Continuous @ T A = 25 ° C
R q JA
P D
I D
100
1.5
7.8
° C/W
W
A
CASE 369AA
DPAK
(Surface Mount)
STYLE 2
CASE 369D
DPAK
(Straight Lead)
STYLE 2
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
T J , T stg
T L
? 55 to
175
260
° C
° C
MARKING DIAGRAM
& PIN ASSIGNMENTS
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq. in pad size.
2. When surface mounted to an FR4 board using minimum recommended
pad size.
1
Gate
4 Drain
2
Drain
3
Source
1
Gate
4 Drain
2
3
Source
Drain
Y
WW
T40N03
G
= Year
= Work Week
= Device Code
= Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2010
July, 2010 ? Rev. 7
1
Publication Order Number:
NTD40N03R/D
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