参数资料
型号: NTF3055L108T3LF
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 60V 3A SOT223
产品变化通告: Specification Change MSL Updated 2/April/2007
Product Discontinuation 03/Apr/2007
标准包装: 4,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 3A
开态Rds(最大)@ Id, Vgs @ 25° C: 120 毫欧 @ 1.5A,5V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 5V
输入电容 (Ciss) @ Vds: 440pF @ 25V
功率 - 最大: 1.3W
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223
包装: 带卷 (TR)
其它名称: NTF3055L108T3LFOS
NTF3055L108,
NVF3055L108
Power MOSFET
3.0 A, 60 V, Logic Level, N ? Channel
SOT ? 223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
? AEC Q101 Qualified ? NVF3055L108
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? Power Supplies
? Converters
? Power Motor Controls
? Bridge Circuits
http://onsemi.com
3.0 A, 60 V
R DS(on) = 120 m W
N ? Channel
D
G
S
MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
Rating
Drain ? to ? Source Voltage
Drain ? to ? Gate Voltage (R GS = 1.0 M W )
Gate ? to ? Source Voltage
Symbol
V DSS
V DGR
Value
60
60
Unit
Vdc
Vdc
1
2
3
4
SOT ? 223
CASE 318E
STYLE 3
? Continuous
? Non ? repetitive (t p ≤ 10 ms)
V GS
± 15
± 20
Vdc
Vpk
MARKING DIAGRAM
Drain Current
Adc
? Continuous @ T A = 25 ° C
? Continuous @ T A = 100 ° C
? Single Pulse (t p ≤ 10 m s)
I D
I D
I DM
3.0
1.4
9.0
Apk
3055L = Device Code
A = Assembly Location
Y = Year
AYW
3055L G
G
Total Power Dissipation @ T A = 25 ° C (Note 1)
Total Power Dissipation @ T A = 25 ° C (Note 2)
Derate above 25 ° C
Operating and Storage Temperature Range
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 25 Vdc, V GS = 5.0 Vdc,
I L(pk) = 7.0 Apk, L = 3.0 mH, V DS = 60 Vdc)
P D
T J , T stg
E AS
2.1
1.3
0.014
? 55
to 175
74
Watts
Watts
W/ ° C
° C
mJ
W = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
4 Drain
Thermal Resistance
? Junction ? to ? Ambient (Note 1)
? Junction ? to ? Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
R q JA
R q JA
T L
72.3
114
260
° C/W
° C
1
Gate
2
Drain
3
Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1 ″ pad size, 1 oz.
(Cu. Area 0.0995 in 2 ).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2 ? 2.4 oz. (Cu. Area 0.272 in 2 ).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 6
1
Publication Order Number:
NTF3055L108/D
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NTF3055L175T1G 功能描述:MOSFET 60V 2A N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTF3055L175T3 功能描述:MOSFET 60V 2A N-Channel RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube