参数资料
型号: NTJD5121NT1G
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: MOSFET N-CH DUAL 60V SOT-363
标准包装: 1
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 295mA
开态Rds(最大)@ Id, Vgs @ 25° C: 1.6 欧姆 @ 500mA,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 0.9nC @ 4.5V
输入电容 (Ciss) @ Vds: 26pF @ 20V
功率 - 最大: 250mW
安装类型: 表面贴装
封装/外壳: 6-TSSOP,SC-88,SOT-363
供应商设备封装: SC-88
包装: 标准包装
其它名称: NTJD5121NT1GOSDKR
NTJD5121N
Power MOSFET
60 V, 295 mA, Dual N ? Channel with ESD
Protection, SC ? 88
Features
? Low R DS(on)
? Low Gate Threshold
? Low Input Capacitance
? ESD Protected Gate
? This is a Pb ? Free Device
Applications
? Low Side Load Switch
? DC ? DC Converters (Buck and Boost Circuits)
V (BR)DSS
60 V
http://onsemi.com
R DS(on) MAX
1.6 W @ 10 V
2.5 W @ 4.5 V
SC ? 88 (SOT ? 363)
I D Max
295 mA
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Symbol
Parameter
Value
Unit
S 1
1
6
D 1
Drain ? to ? Source Voltage
V DSS
60
V
G 1
2
5
G 2
Gate ? to ? Source Voltage
V GS
± 20
V
Continuous Drain
Current (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
295
212
mA
D 2
3
4
S 2
t ≤ 5s
T A = 25 ° C
T A = 85 ° C
304
219
Top View
Power Dissipation
(Note 1)
Steady
State
T A = 25 ° C
P D
250
mW
MARKING DIAGRAM &
PIN ASSIGNMENT
Pulsed Drain Current
t ≤ 5s
t p = 10 m s
I DM
266
900
mA
1
6
D1 G2 S2
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J , T STG
I S
? 55 to
150
210
° C
mA
SC ? 88/SOT ? 363
CASE 419B
STYLE 26
1
TF M G
G
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
Gate ? Source ESD Rating (HBM)
T L
ESD HBM
260
2000
° C
V
TF
M
G
S1 G1 D2
= Device Code
= Date Code
= Pb ? Free Package
Gate ? Source ESD Rating (MM)
ESD MM
200
V
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
Device Package Shipping ?
THERMAL RESISTANCE RATINGS
NTJD5121NT1G
SC ? 88
3000 / Tape & Reel
Parameter
Symbol
Value
Unit
(Pb ? Free)
Junction ? to ? Ambient – Steady State R q JA
Junction ? to ? Ambient – t ≤ 5 s R q JA
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [2 oz] including traces).
? Semiconductor Components Industries, LLC, 2013
October, 2013 ? Rev. 6
500
470
1
° C/W
NTJD5121NT2G SC ? 88 3000 / Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTJD5121N/D
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