参数资料
型号: NTMD2C02R2
厂商: ON Semiconductor
文件页数: 2/12页
文件大小: 0K
描述: MOSFET PWR N/P-CH DUAL 20V 8SOIC
产品变化通告: LTB Notification 03/Jan/2008
Wire Change 20/Aug/2008
标准包装: 2,500
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 5.2A,3.4A
开态Rds(最大)@ Id, Vgs @ 25° C: 43 毫欧 @ 4A,4.5V
Id 时的 Vgs(th)(最大): 1.2V @ 250µA
闸电荷(Qg) @ Vgs: 20nC @ 4.5V
输入电容 (Ciss) @ Vds: 1100pF @ 10V
功率 - 最大: 2W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 带卷 (TR)
其它名称: NTMD2C02R2OS
NTMD2C02R2
ELECTRICAL CHARACTERISTICS (T A = 25 ° C unless otherwise noted) (Note 3)
Characteristic
Symbol
Polarity
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain ? Source Breakdown Voltage
(V GS = 0 Vdc, I D = 250 m Adc)
Zero Gate Voltage Drain Current
(V GS = 0 Vdc, V DS = 20 Vdc)
(V GS = 0 Vdc, V DS = 12 Vdc)
Gate ? Body Leakage Current
(V GS = ± 12 Vdc, V DS = 0)
V (BR)DSS
I DSS
I GSS
(N)
(P)
(N)
(P)
?
20
20
?
?
?
?
?
?
?
?
?
?
1.0
1.0
100
Vdc
m Adc
nAdc
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
(V DS = V GS , I D = 250 m Adc)
Drain ? to ? Source On ? Resistance
(V GS = 4.5 Vdc, I D = 4.0 Adc)
(V GS = 4.5 Vdc, I D = 2.4 Adc)
Drain ? to ? Source On ? Resistance
(V GS = 2.7 Vdc, I D = 2.0 Adc)
(V GS = 2.7 Vdc, I D = 1.2 Adc)
Forward Transconductance
(V DS = 2.5 Vdc, I D = 2.0 Adc)
(V DS = 2.5 Vdc, I D = 1.0 Adc)
V GS(th)
R DS(on)
R DS(on)
g FS
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
0.6
0.6
?
0.07
?
0.1
3.0
3.0
0.9
0.9
0.028
?
0.033
?
6.0
4.75
1.2
1.2
0.043
0.1
0.048
0.13
?
?
Vdc
W
W
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
C iss
(N)
(P)
?
?
785
540
1100
750
pF
Output Capacitance
Transfer Capacitance
(V DS = 10 Vdc, V GS = 0 Vdc,
f = 1.0 MHz)
C oss
C rss
(N)
(P)
(N)
(P)
?
?
?
?
210
215
75
100
450
325
180
175
SWITCHING CHARACTERISTICS (Note 5)
Turn ? On Delay Time
Rise Time
Turn ? Off Delay Time
Fall Time
Turn ? On Delay Time
Rise Time
Turn ? Off Delay Time
Fall Time
Total Gate Charge
Gate ? Source Charge
Gate ? Drain Charge
(V DD = 16 Vdc, I D = 4.0 Adc,
V GS = 4.5 Vdc,
R G = 6.0 W )
(V DD = 10 Vdc, I D = 1.2 Adc,
V GS = 2.7 Vdc,
R G = 6.0 W )
(V DS = 16 Vdc, I D = 6.0 Adc,
V GS = 4.5 Vdc,
R G = 6.0 W )
(V DS = 10 Vdc, I D = 2.4 Adc,
V GS = 4.5 Vdc,
R G = 6.0 W )
(V DS = 10 Vdc, I D = 4.0 Adc,
V GS = 4.5 Vdc)
(V DS = 6.0 Vdc, I D = 2.0 Adc,
V GS = 4.5 Vdc)
t d(on)
t r
t d(off)
t f
t d(on)
t r
t d(off)
t f
Q T
Q 1
Q 2
Q 3
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
(N)
(P)
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
11
15
35
40
45
35
60
35
12
10
50
35
45
33
80
29
12
10
1.5
1.5
4.0
5.0
3.0
3.0
18
?
65
?
75
?
110
?
20
20
90
65
75
60
130
55
20
18
?
?
?
?
?
?
ns
nC
3. Negative signs for P ? Channel device omitted for clarity.
4. Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2%.
5. Switching characteristics are independent of operating junction temperature.
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