参数资料
型号: NTMFS4821NT1G
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 30V 8.8A SO-8FL
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 8.8A
开态Rds(最大)@ Id, Vgs @ 25° C: 6.95 毫欧 @ 30A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 16nC @ 4.5V
输入电容 (Ciss) @ Vds: 1400pF @ 12V
功率 - 最大: 870mW
安装类型: 表面贴装
封装/外壳: 8-TDFN 裸露焊盘(5 引线)
供应商设备封装: 6-DFN,8-SO 扁平引线(5x6)
包装: 标准包装
其它名称: NTMFS4821NT1GOSDKR
NTMFS4821N
Power MOSFET
30 V, 58.5 A, Single N ? Channel, SO ? 8 FL
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? Thermally Enhanced SO ? 8 Package
? These are Pb ? Free Device
Applications
? Refer to Application Note AND8195/D
? CPU Power Delivery
? DC ? DC Converters
? High Side Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(ON) MAX
6.95 m W @ 10 V
10.8 m W @ 4.5 V
D (5,6)
I D MAX
58.5 A
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
± 20
V
V
G (4)
Continuous Drain
Current R q JA
(Note 1)
Power Dissipation
R q JA (Note 1)
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
13.8
10
2.14
A
W
S (1,2,3)
N ? CHANNEL MOSFET
S
4821N
S
AYWZZ
Continuous Drain
Current R q JA v
10 sec
Power Dissipation
R q JA, t v 10 sec
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
Pulsed Drain
Current
Steady
State
t p =10 m s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
T A = 25 ° C
I D
P D
I D
P D
I D
P D
I DM
22.4
16.1
5.61
8.8
6.4
0.87
58.5
42.3
38.5
117
A
W
A
W
A
W
A
MARKING
DIAGRAM
D
1
SO ? 8 FLAT LEAD S
CASE 488AA G
STYLE 1 D
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
D
D
Current limited by package
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source dV/dt
T A = 25 ° C
I Dmaxpkg
T J ,
T STG
I S
dV/dt
100
? 55 to
+150
38.5
6
A
° C
A
V/ns
Device
NTMFS4821NT1G
NTMFS4821NT3G
Package
SO ? 8FL
(Pb ? Free)
SO ? 8FL
Shipping ?
1500 /
Tape & Reel
5000 /
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 50 V, V GS = 10 V,
I L = 24 A pk , L = 0.3 mH, R G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
EAS
T L
86
260
mJ
° C
(Pb ? Free) Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb ? Free strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 4
1
Publication Order Number:
NTMFS4821N/D
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