参数资料
型号: NTTFS4932NTWG
厂商: ON Semiconductor
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 30V 11A 8WDFN
标准包装: 5,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 11A
开态Rds(最大)@ Id, Vgs @ 25° C: 4 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 2.2V @ 250µA
闸电荷(Qg) @ Vgs: 46.5nC @ 10V
输入电容 (Ciss) @ Vds: 3111pF @ 15V
功率 - 最大: 850mW
安装类型: 表面贴装
封装/外壳: 8-WDFN 裸露焊盘
供应商设备封装: 8-WDFN(3.3x3.3)
包装: 带卷 (TR)
NTTFS4932N
Power MOSFET
30 V, 79 A, Single N ? Channel, m 8FL
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? Low ? Side DC ? DC Converters
? Power Load Switch
? Notebook Battery Management
? Motor Control
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) MAX
4.0 m W @ 10 V
5.5 m W @ 4.5 V
N ? Channel MOSFET
D (5 ? 8)
I D MAX
79 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
V GS
± 20
V
G (4)
Continuous Drain
Current R q JA (Note 1)
Power Dissipation R q JA
(Note 1)
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
18
13
2.2
A
W
S (1,2,3)
MARKING DIAGRAM
Continuous Drain
Current R q JA ≤ 10 s
(Note 1)
Power Dissipation
R q JA ≤ 10 s (Note 1)
Continuous Drain
Current R q JA (Note 2)
Power Dissipation
R q JA (Note 2)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
I D
P D
25.5
18.5
4.5
11
8.0
0.85
A
W
A
W
1
WDFN8
( m 8FL)
CASE 511AB
4932
A
Y
WW
1
S
S 4932
S AYWW G
G G
= Specific Device Code
= Assembly Location
= Year
= Work Week
D
D
D
D
Continuous Drain
Current R q JC (Note 1)
T C = 25 ° C
T C = 85 ° C
I D
79
57
A
G = Pb ? Free Package
(Note: Microdot may be in either location)
Power Dissipation T C = 25 ° C
R q JC (Note 1)
Pulsed Drain Current T A = 25 ° C, t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
P D
I DM
T J ,
T stg
I S
43
235
? 55 to
+150
39
W
A
° C
A
ORDERING INFORMATION
Device Package Shipping ?
NTTFS4932NTAG WDFN8 1500/Tape & Reel
(Pb ? Free)
Drain to Source dV/dt
dV/dt
6.0
V/ns
NTTFS4932NTWG
WDFN8
5000/Tape & Reel
Single Pulse Drain ? to ? Source Avalanche Energy
(T J = 25 ° C, V DD = 50 V, V GS = 10 V,
I L = 43 A pk , L = 0.1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
E AS
T L
92.4
260
mJ
° C
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2011
November, 2011 ? Rev. 2
1
Publication Order Number:
NTTFS4932N/D
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