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参数资料
| 型号： | NUD4001DEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR NUD4001D |
| 设计资源： | NUD4001 EVB BOM NUD4001DEVB Gerber Files NUD4001 EVB Schematic |
| 标准包装： | 1 |
| 电流 - 输出 / 通道： | 350mA |
| 输出及类型： | 1，非隔离 |
| 输入电压： | 12V |
| 已供物品： | 板 |
| 已用 IC / 零件： | NUD4001 |
| 其它名称： | NUD4001DEVBOS |
NUD4001, NSVD4001
THERMAL INFORMATION
PD + Jmax
NUD4001, NSVD4001 Power Dissipation
The power dissipation of the SO ? 8 is a function of the pad
size. This can vary from the minimum pad size for soldering
to a pad size given for maximum power dissipation. Power
dissipation for a surface mount device is determined by
T J(max) , the maximum rated junction temperature of the die,
R q JA , the thermal resistance from the device junction to
ambient, and the operating temperature, T A . Using the
values provided on the data sheet for the SO ? 8 package, P D
can be calculated as follows:
T * TA
R q JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature T A of 25 ° C, one can
calculate the power dissipation of the device which in this
case is 1.13 W.
reduce the thermal resistance. Figure 11 shows how the
thermal resistance changes for different copper areas.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad ? . Using a
board material such as Thermal Clad or an aluminum core
board, the power dissipation can be even doubled using the
same footprint.
180
160
140
120
100
PD + 150 ° C * 25 ° C + 1.13 W
110 ° C
The 110 ° C/W for the SO ? 8 package assumes the use of a
FR ? 4 copper board with an area of 2 square inches with 2 oz
80
60
0
1
2
3
4
5
6
7
8
9
10
coverage to achieve a power dissipation of 1.13 W. There are
other alternatives to achieving higher dissipation from the
SOIC package. One of them is to increase the copper area to
BOARD AREA (in 2 )
Figure 11. q JA versus Board Area
250
1S ? 36.9 sq. mm ? 0.057 in sq.
200
150
100
50
1S ? 75.8 sq. mm ? 0.117 in sq.
1S ? 150.0 sq. mm ? 0.233 in sq.
1S ? 321.5 sq. mm ? 0.498 in sq.
1S ? 681.0 sq. mm ? 1.056 in sq.
1S ? 1255.0 sq. mm ? 1.945 in sq.
0
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
TIME (sec)
Figure 12. Transient Thermal Response
http://onsemi.com
7
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NUD4001DR2 | 功能描述:LED照明驱动器 High Current LED RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| NUD4001DR2G | 功能描述:LED照明驱动器 MI 60V LED DRVR TR RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| NUD4001DR2G-CUT TAPE | 制造商:ON 功能描述:NUD4001 Series 500 mA 30 V Surface Mount High Current LED Driver - SOIC-8 |
| NUD4011 | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Low Current LED Driver |
| NUD4011/D | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Low Current LED Driver |
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