参数资料
型号: NUF3101FCT1
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: IC FILTER 3CH EMI SIM 8-FLIPCHIP
标准包装: 3,000
类型: 低通
技术: RC(Pi)
通道数: 3
中心 / 截止频率: 300MHz(截止值)
衰减值: 25dB @ 800MHz ~ 2.2GHz
电阻 - 通道 (Ohms): 47,100
值: R = 47,100 欧姆,C = 40pF
ESD 保护:
滤波器阶数: 2nd
应用: SIM 卡
封装/外壳: 8-WFBGA,FCBGA
尺寸/尺寸: 0.061" L x 0.061" W(1.55mm x 1.55mm)
高度: 0.028"(0.70mm)
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
NUF3101FC
Three Line EMI Filter
This device is a three ? line EMI filter array for SIM Card wireless
applications. Greater than ? 25 dB attenuation is obtained at
frequencies from 800 MHz to 2.2 GHz. ESD protection is provided
across all capacitors.
Features
? EMI Filtering and ESD Protection
? Integration of 10 Discretes
? Provides Protection for IEC61000 ? 4 ? 2 (Level 4)
? 8.0 kV (Contact)
? 15 kV (Air)
? Flip ? Chip Package
? Moisture Sensitivity Level 1
? ESD Rating: Machine Model = C; Human Body Model = 3B
? Pb ? Free Package is Available*
A3
B3
C3
C2
http://onsemi.com
100 R
47 R
100 R
A2
B1
C1
1
3101
AYWW G
G
Benefits
? Reduces EMI/RFI Emissions on a Data Line
? Integrated Solution Offers Cost and Space Savings
? Reduces Parasitic Inductances Which Offer a More “Ideal”
Low Pass Filter Response
? Integrated Solution Improves System Reliability
Applications
? SIM Card
? EMI Filtering and ESD Protection for Data Lines
? Cell Phones
? Handheld Products
B2
GND
MARKING
DIAGRAM
A2
8 ? Pin Flip ? Chip
FC SUFFIX
CASE 499AG
3101 = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
MAXIMUM RATINGS (T A = 25 ° C unless otherwise noted)
Rating Symbol
Value
Unit
PIN CONFIGURATION
ESD Discharge
IEC61000 ? 4 ? 2
Air Discharge
Contact Discharge
V PP
15
8.0
kV
A3
A2
Steady ? State Power per Resistor
P R
100
mW
B3
B2
B1
Steady ? State Power per Package
P T
300
mW
Operating Temperature Range
T OP
? 40 to +85
° C
C3
C2
C1
Storage Temperature Range
T STG
? 55 to +150
° C
Junction Temperature
T J
+125
° C
ORDERING INFORMATION
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device
NUF3101FCT1
NUF3101FCT1G
Package
Flip ? Chip
Flip ? Chip
Shipping ?
3000 Tape & Reel
3000 Tape & Reel
(Pb ? Free)
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2006
March, 2006 ? Rev. 2
1
Publication Order Number:
NUF3101FC/D
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