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参数资料
| 型号： | NUF9002FCT1G |
| 厂商： | ON Semiconductor |
| 文件页数： | 1/4页 |
| 文件大小： | 0K |
| 描述： | IC FILTER 10CH EMI ESD 25FLPCHIP |
| 产品变化通告： | 1Q2012 Discontinuation 30/Mar/2012 |
| 标准包装： | 1 |
| 类型： | 低通 |
| 技术： | RC（Pi） |
| 通道数： | 10 |
| 中心 / 截止频率： | 110MHz（截止值） |
| 衰减值： | 25dB @ 900MHz ~ 3GHz |
| 电阻 - 通道 (Ohms)： | 100 |
| 值： | R = 100 欧姆，C = 28pF |
| ESD 保护： | 是 |
| 滤波器阶数： | 2nd |
| 应用： | 移动设备的数据线路 |
| 封装/外壳： | 25-UFBGA，FCBGA |
| 尺寸/尺寸： | 0.104" L x 0.104" W（2.65mm x 2.65mm） |
| 高度： | 0.026"（0.65mm） |
| 包装： | 剪切带 (CT) |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | NUF9002FCT1GOSCT |
NUF9002FC
Low Capacitance 10 Line
EMI Filter with ESD
Protection
This device is a ten ? line EMI filter array for wireless applications.
Greater than ? 25 dB attenuation is obtained at frequencies from
900 MHz to 3.0 GHz. ESD protection is provided across all
http://onsemi.com
capacitors.
INPUT
LOW ? PASS FILTER
OUTPUT
A1
Features
? EMI Filtering and ESD Protection
? Integration of 50 Discretes
? Provides Protection for IEC61000 ? 4 ? 2 (Level 4)
? 8.0 kV (Contact)
? Flip ? Chip Package
? Moisture Sensitivity Level 1
? ESD Rating: Machine Model = C; Human Body Model = 3B
? Pb ? Free Package is Available*
Benefits
? Reduces EMI/RFI Emissions on a Data Line
? Integrated Solution Offers Cost and Space Savings
? Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
? Integrated Solution Improves System Reliability
R I/O = 100 W
C input = 28 pF
MARKING DIAGRAM
NUF9002
Flip ? Chip AYWW G
CASE 499G G
NUF9002 = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
Applications
? LCD for Cell Phones and PDAs
? Computers and Printers
? Communication Systems
? MP3 Players
E
1
O1
PIN CONFIGURATION
(Ball Side)
2 3 4
O2 O3 O4
5
O5
MAXIMUM RATINGS (T A = 25 ° C unless otherwise noted)
D
O6
O7
O8
O9
O10
Rating
ESD Discharge Contact Discharge
IEC61000 ? 4 ? 2
Steady ? State Power per Resistor
Steady ? State Power per Package
Symbol
V PP
P R
P T
Value
8.0
100
200
Unit
kV
mW
mW
C
B
A
GND
IN6
IN1
GND
IN7
IN2
GND
IN8
IN3
GND
IN9
IN4
GND
IN10
IN5
Operating Temperature Range
T OP
? 40 to +85
° C
Storage Temperature Range
T STG
? 55 to +150
° C
ORDERING INFORMATION
Junction Temperature
T J
+125
° C
Device
Package
Shipping ?
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NUF9002FCT1
NUF9002FCT1G
Flip ? Chip
Flip ? Chip
(Pb ? Free)
3000 Tape & Reel
3000 Tape & Reel
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2006
March, 2006 ? Rev. 1
1
Publication Order Number:
NUF9002FC/D
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