参数资料
型号: NUP4012PXV6T1G
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: TVS ARRAY QUAD LOW CAP SOT-563
产品变化通告: Wire Bond Change 01/Dec/2010
标准包装: 4,000
电压 - 反向隔离(标准值): 4V
电压 - 击穿: 5.2V
电极标记: 4 通道阵列 - 双向
安装类型: 表面贴装
封装/外壳: SOT-563,SOT-666
供应商设备封装: SOT-563
包装: 带卷 (TR)
NUP4012PXV6
Quad Transient Voltage
Suppressor Array
ESD Protection Diodes with Ultra ? Low
(0.7 pF) Capacitance
The four ? line voltage transient suppressor array is designed to protect
voltage ? sensitive components that require ultra ? low capacitance from
ESD and transient voltage events. This device features a common anode
design which protects four independent data lines in a single SOT ? 563
low profile package.
Excellent clamping capability, low capacitance, low leakage, and fast
response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs.
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http://onsemi.com
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Features
? Low Capacitance (0.7 pF Typical)
? Protects up to Four Data Lines
? SOT ? 563 1.6 mm x 1.6 mm
? Low Profile of 0.55 mm for Slim Design Ultra
? D 1 , D 2 , D 3 , and D 4 Pins = 5.2 V Minimum Protection
? ESD Rating: IEC61000 ? 4 ? 2: Level 4
? This is a Pb ? Free Device
Typical Applications
? USB 2.0 High ? Speed Interface
? Cell Phones
? MP3 Players
? SIM Card Protection
MAXIMUM RATINGS (T J = 25 ° C, unless otherwise specified)
SOT ? 563
CASE 463A
MARKING DIAGRAM
P7 M G
G
P7 = Device Code
M = Date Code*
G = Pb ? Free Package
(Note: Microdot may be in either location)
Symbol
T J
T STG
Rating
Operating Junction Temperature Range
Storage Temperature Range
Value
? 40 to 125
? 55 to 150
Unit
° C
° C
ORDERING INFORMATION
Device Package Shipping ?
T L
Lead Solder Temperature – Maximum
(10 seconds)
260
° C
NUP4012PXV6T1G
SOT ? 563 3000/Tape & Reel
(Pb ? Free)
ESD IEC 61000 ? 4 ? 2 Contact 8000 V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2009
August, 2009 ? Rev. 1
1
Publication Order Number:
NUP4012PXV6/D
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