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| 型号： | NUP6012PMUTAG |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/3页 |
| 文件大小： | 0K |
| 描述： | TVS ESD 6CH LOW CAP 6-UDFN |
| 产品变化通告： | Product Obsolescence 13/Apr/2009 |
| 标准包装： | 3,000 |
| 电压 - 反向隔离（标准值）： | 4V |
| 电压 - 击穿： | 5.2V |
| 电极标记： | 6 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UFDFN 裸露焊盘 |
| 供应商设备封装： | 6-UDFN（1.6x1.6） |
| 包装： | 带卷 (TR) |
NUP6012PMU
PACKAGE DIMENSIONS
UDFN6, 1.6x1.6, 0.5P
CASE 517AP ? 01
ISSUE O
D2
L
DETAIL A
MILLIMETERS
DIM
MIN MAX
A1 0.00 0.05
0.13 REF
A3
A3
A1
DETAIL B
L 0.20 0.40
0.00 0.15
L1
D
2X
0.10 C
PIN ONE
REFERENCE
2X
0.10 C
TOP VIEW
DETAIL B
0.05 C
6X 0.05 C
SIDE VIEW
DETAIL A
6X L
1 3
A1
A
B
E
(A3)
A
C
SEATING
PLANE
L1 AND IS MEASURED BETWEEN 0.15 AND
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
OPTIONAL
CONSTRUCTION
A 0.45 0.55
EXPOSED Cu MOLD CMPD
b 0.20 0.30
D 1.60 BSC
E 1.60 BSC
e 0.50 BSC
D2 1.10 1.30
E2 0.45 0.65
K 0.20 ???
OPTIONAL
CONSTRUCTION
SOLDERMASK DEFINED
MOUNTING FOOTPRINT*
1.26
E2
6X
K
6
5
6X
b
6X
0.52
0.61 1.90
e
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
0.50 PITCH
1
6X
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NUP6012PMU/D
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