参数资料
型号: NV8664ST50T3GEVB
厂商: ON Semiconductor
文件页数: 13/14页
文件大小: 0K
描述: EVAL BOARD FOR NV8664ST50T3G
设计资源: NCV8664 EVB BOM
NV8664ST50T3GEVB Gerber Files
NCV8664 EVB Schematic
标准包装: 1
每 IC 通道数: 1 - 单
输出电压: 5V
电流 - 输出: 150mA
输入电压: 5.5 ~ 45 V
稳压器类型: 正,固定式
板类型: 完全填充
已供物品:
已用 IC / 零件: NV8664
其它名称: NV8664ST50T3GEVBOS
NCV8664
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
DT SUFFIX
CASE 369C ? 01
ISSUE D
L3
1
E
b3
4
2
3
A
D
B
DETAIL A
A
C
c2
H
Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
INCHES
MILLIMETERS
L4
b2
e
b
0.005 (0.13)
M
C
c
L2
GAUGE
PLANE
L
L1
DETAIL A
ROTATED 90 5 CW
A1
H
C
SEATING
PLANE
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
MIN MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
??? 0.040
0.155 ???
MIN MAX
2.18 2.38
0.00 0.13
0.63 0.89
0.76 1.14
4.57 5.46
0.46 0.61
0.46 0.61
5.97 6.22
6.35 6.73
2.29 BSC
9.40 10.41
1.40 1.78
2.74 REF
0.51 BSC
0.89 1.27
??? 1.01
3.93 ???
SOLDERING FOOTPRINT*
6.20
3.00
0.244
2.58
0.102
0.118
5.80
0.228
1.60
0.063
6.17
0.243
SCALE 3:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
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