参数资料
| 型号： | NVD0.7EGG-M6 |
| 厂商： | Power-One |
| 文件页数： | 9/11页 |
| 文件大小： | 0K |
| 描述： | CONVERT DC/DC +-5V OUT 6W SMD |
| 标准包装： | 28 |
| 系列： | * |
NV Series Data Sheet
6 W SMT DC-DC Converters, 3.3 – 48 V Output
Surface Mount Assembly
Soldering
The following soldering instructions must be observed
to prevent failure or significant degradation of the
module performance. Power-One will not honor any
warranty claims arising from failure to observe these
instructions.
The lead-frame is constructed for a high temperature
glass filled, UL94 V-0 flame retardant, dually ortho-
phthalate molding compound commonly used for
packaging of electronics components. It has passed
NASA outgassing tests, and is certified to MIL-M-14.
The coefficient of thermal expansion is equivalent to
FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore they
facilitate visual inspection (manual or automatic). The
leads are formed from a 97% Cu alloy plated with Ni
and matte Sn. This material is commonly used
in the manufacture of integrated circuits. It has good
corrosion resistance and exhibits the nobility inherent
to all high copper alloys. Unlike brasses, this material
is essentially immune to stress corrosion cracking. It
also exhibits excellent solderability. It is readily wetted
by solders and performs well in standard solderability
tests. (Dip of Class II or better).
The product is manufactured with a patented process,
which is fully automated, and ‘in-line’. This ensures
that there is no contamination or mechanical stress on
the lead-frame so that the co planarity and
solderability are maintained.
The product is shipped in JEDEC trays to ensure
preservation of the co-planarity and enable fully
automated assembly in the final application. Mind the
marking for pin 1!
These products are approved for forced convection
reflow soldering only. Products RoHS-compliant for all
6 substances (model designation ending with -M6G)
allow for a solder profile with higher temperatures; see
tables below.
Recommended Reflow Profile (measured at the leads of the converter)
Product
Pre-heat ramp
Pre-heat soaking
Ramp to
reflow
Reflow
Cooling
From
°C
To
°C
Rate
°C/s
From
°C
To
°C
Time
s
Rate
°C
Time
above
liquidus
s
Peak
temp.
°C
Time within
±5 °C of
peak temp
s
Time
to
peak
s
Rate
°C/s
-M6
(Sn-Pb eutectic)
-M6G
(lead-free)
25
25
150
180
2
2
150
180
183
217
90 - 120
90 - 120
2
2
45
45
220 ±5
240 ±5
10
10
180
210
3
3
Worst Case Reflow Parameters Following J-STD-020D (measured in the center, on top side of the converter)
Product
Pre-heat ramp
Pre-heat soaking
Ramp to
reflow
Reflow
Cooling
From
To
Rate
From
To
Max.
time
Rate
Max. time
above
liquidus
Max.
peak
temp.
Max. time Max.
within ±5 °C time to
of peak temp. peak
Rate
°C
°C
°C/s
°C
°C
s
°C
s
°C
s
s
°C/s
-M6
(Sn-Pb eutectic)
-M6G
(lead-free)
25
25
150
180
3
3
100
150
150
200
120
120
3
3
45
45
230
260
10
10
360
480
6
6
BCD.00014 Rev. AA, 30-June-2010
Page 9 of 11
www.power-one.com
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