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参数资料
| 型号： | NVT2008PW |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 通用总线功能 |
| 英文描述： | Bidirectional voltage-level translator for open-drain and push-pull applications |
| 中文描述： | GTL TO TTL TRANSCEIVER, PDSO20 |
| 封装： | 4.40 MM, LEAD FREE, PLASTIC, MO-153, SOT360-1, TSSOP-20 |
| 文件页数： | 2/26页 |
| 文件大小： | 459K |
| 代理商： | NVT2008PW |
NVT2008_NVT2010
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 8 September 2010
2 of 26
NXP Semiconductors
NVT2008; NVT2010
Bidirectional voltage-level translator
Low 3.5
Ω
ON-state connection between input and output ports provides less signal
distortion
5 V tolerant I/O ports to support mixed-mode signal operation
High-impedance An and Bn pins for EN = LOW
Lock-up free operation
Flow through pinout for ease of printed-circuit board trace routing
ESD protection exceeds 4 kV HBM per JESD22-A114, 200 V MM per JESD22-A115,
and 1000 V CDM per JESD22-C101
Packages offered: TSSOP20, DHVQFN20, TSSOP24, DHVQFN24, HVQFN24
3. Ordering information
[1]
GTL2003 = NVT2008.
[2]
GTL2010 = NVT2010.
Table 1.
T
amb
=
40
°
C to +85
°
C.
Type number
Ordering information
Topside
mark
Number
of bits
Package
Name
DHVQFN20
Description
plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 24 terminals;
body 3.5
×
5.5
×
0.85 mm
plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4
×
4
×
0.85 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
Version
SOT764-1
NVT2008BQ
[1]
NVT2008
8
NVT2008PW
[1]
NVT2008
8
TSSOP20
SOT360-1
NVT2010BQ
[2]
NVT2010
10
DHVQFN24
SOT815-1
NVT2010BS
[2]
N010
10
HVQFN24
SOT616-1
NVT2010PW
[2]
NVT2010
10
TSSOP24
SOT355-1
相关PDF资料 |
PDF描述 |
|---|---|
| NVT2010BQ | Bidirectional voltage-level translator for open-drain and push-pull applications |
| NVT2010BS | Bidirectional voltage-level translator for open-drain and push-pull applications |
| NVT2010PW | Bidirectional voltage-level translator for open-drain and push-pull applications |
| NX1117CE12Z | Low-dropout linear regulators |
| NX1117CE19Z | Low-dropout linear regulators |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NVT2008PW,118 | 功能描述:转换 - 电压电平 +/-50mA 1.5ns 1-5.5V RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| NVT2010 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Smart, simple solutions for the 12 most common design concerns |
| NVT2010BQ,118 | 功能描述:转换 - 电压电平 +/-50mA 1.5ns 1-5.5V RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| NVT2010BS,115 | 功能描述:转换 - 电压电平 +/-50mA 1.5ns 1-5.5V RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| NVT2010BS,118 | 功能描述:转换 - 电压电平 BIDIRCTIONL VOLT-LVL TRANSL O-DRN P-P APP RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
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