参数资料
型号: OAR5R015FLF
厂商: TT Electronics/IRC
文件页数: 2/4页
文件大小: 0K
描述: RES METAL .015 OHM 5W 1% RADIAL
标准包装: 1,000
系列: OAR
电阻(欧姆): 0.015
功率(瓦特): 5W
复合体: 金属元素
特点: 电流感应,耐燃
温度系数: ±20ppm/°C
容差: ±1%
封装/外壳: 径向
尺寸/尺寸: 0.800" L x 0.065" W(20.32mm x 1.65mm)
高度: 0.882"(22.40mm)
端子数: 2
包装: 散装
其它名称: 989-1098
OAR-5-.015-OHM-1-LF
OAR-5-R015-F-LF
Open Air
OAR Resistor
Metal Air Current
Open Element Resistor Sense
OAR &               Series
Metal OAR-TP Element Current Sense
OAR
Open Air Data Data
Physical Resistor
Metal Element Current Sense
On lower ranges stand-off may be
eliminated
Physical Data
C
B
A
E
F
NOTE:
Contact factory for:
1. Variations of “A” dimension.
2. Different lead diameter.
On lower ranges stand-off may be
eliminated
Test Point (Kelvin connection)
OAR1TP
0.197 +0.04/-0.03
(11.43 (5.0 +1.0/-0.8 )
0.3 (7.8)
E 1.
F
0.065 +0.010/-0.005 0.040 ±0.002
Type
C T y p
I OAR1 e
OAR-1
A
0.45 A +0.04/-0.02
(11.43 +1.02/-0.51 )
0.450 +0.040/-0.020
+1.020/-0.508)
B
B max                          C
Dimensions (Inches and (mm))
C
B
0.32 (8.12) C
0.27 Typ 0.125 ±0.030
0.32 (8.12) max (3.18 ±0.762)
A
NOTE:
Contact factory for:
Variations of “A” dimension.
2. Different lead diameter.
E E F
F
Test Point (Kelvin connection)
(1.65 +0.254/-0.127) (1.02 ±0.051)
0.600 +0.040/-0.020 Dimensions (Inches ±0.030 (mm)) 0.065 +0.010/-0.005
0.125 ±0.030 ±0.76 ) 0.065 +0.010/-0.005
(3.18
(1.65 +0.25/-0.13 )
0.450 +0.040/-0.020 )
(7.0 +1.0/-0.8
<R005
1.0 (25.4) (3.18 ±0.762)
(11.43 0.197 +0.04/-0.03 0.32 (8.12) max
OAR3TP
Thermal Image Data
(15.24 +1.020/0.508) 0.92 (23.4) max (3.18 ±0.762) (1.65 +0.254/-0.127)
(20.32 +1.02/-0.51 )
0.275 +0.04/-0.03 0.88 (22.4) max
OAR5TP (20.32 +1.020/-0.508) 1.1 (27.9) (3.18 ±0.762) (1.65 +0.254/-0.127)
0.040 (1.02 ±0.002 )
OAR-3 0.92 (23.4)
+1.02/-0.51
(15.24 (15.24 +1.020/0.508) ) 0.92 (23.4) max (3.18 ±0.762) (1.65 +0.254/-0.127)
E
I R C T y p e A B C 0.125 ±0.03 0.065 +0.01/-0.005
0.275 +0.04/-0.03
OAR3TP 0.800 +0.040/-0.020 0.65 Typ
OAR-5 0.27 Typ 0.125 ±0.030 0.065 +0.010/-0.005
OAR-1 (20.32 +1.020/-0.508) 0.88 (22.4) max (3.18 ±0.762) (1.65 +0.254/-0.127)
+1.020/-0.508) (1.65 +0.254/-0.127)
(5.0 +1.0/-0.8
≥ R005 0.600 +0.040/-0.020 ) 0.65 Typ       0.12 5 ±0.030 0.065 +0.010/-0.005
OAR-3
OAR5 0.88 (22.4)
0.800 +0.040/-0.020 0.65 Typ       0.12 5 ±0.030 0.065 +0.010/-0.005
OAR-5
(7.0 +1.0/-0.8 )
Thermal Image Data
0.040 ±0.002
(1.02 ±0.051)
F
0.04 ±0.002
0.040 ±0.002
(1.02 ±0.051)
(1.02 ±0.051)
0.040 ±0.002
(1.02 ±0.051)
0.040 ±0.002
(1.02 ±0.051)
OAR-1 5 m ? @ 1 Watt
OAR-3 5 m ? @ 3 Watt
OAR-5 5 m ? @ 5 Watt
Hot Spot:
87°C
Hot Spot:
160°C
Hot Spot:
230°C
Solder Joint: 45°C
Solder Joint:
70°C
Solder Joint:
96°C
The standard test circuit board consists of a four layer FR4 material with 2 ounce (70μm) outer layers and 1 ounce
5 m ? @ 3Watt                                        5 m ? @ 5 thetureof 5 m ? @ 1 from                                                                                       board. OAR-3
The thermal images (not simulations) above are of the OAR products at their respective power rating. Notice the
solder joint temperature is much lower than the hotspot. The unique construction of the OAR isolates the tempera-
OAR-1 the hotspot Watt the circuit board material preventing damage to the circuit OAR-5 Additionally, Watt thermal
Hot Spot:Hot is 87°C into Hot Spot: a
Solder Joint: 45°C
energy Spot: dissipated to the air instead of being conducted 160°C the circuit board potentially causing 230°C nearby power
component to exceed its rating. Solder Joint: 70°C Solder Joint: 96°C
thermal test (not board consists of the FR4 material at 2 ounce (70μm) outer 1 layers and the
inner layers, is is lower of than the industry The The test conditions the in isolates the tempera- solder joint
ture of the hotspot from the 22 °C with forced air. Contact TT the for more or for other
test is for specific the values and power levels.
The standard images circuit simulations) above are four layer OAR products with their respective power rating. Notice ounce
(35μm) temperature which much typical many hotspot. designs. unique construction of were OAR ambient temperature
conditions, approximately circuit board no material preventing damage electronics circuit board. details Additionally, the thermal image
energy data dissipated to resistance instead of being conducted into the circuit board potentially causing a nearby power
component to exceed its rating.
Wire and Film Technologies Division ? 4222 SOUTH STAPLES STREET ? CORPUS CHRISTI T EXAS 78411 USA
T ELEPHONE : 361 992 7900 ? F ACSIMILE : 361 992 3377 ? W EBSITE : WWW.IRCTT.COM O AR SERIES ISSUE J UNE 2011 SHEET 2 OF 3
(35μm) inner layers, which is typical of many industry designs. The test conditions were in ambient temperature
conditions, approximately 22 °C with no forced air. Contact TT electronics for more details or for other thermal image
test data for specific resistance values and power levels.
Wire and Film Technologies Division ? 4222 SOUTH STAPLES STREET ? CORPUS CHRISTI T EXAS 78411 USA
TELEPHONE:3619927900
General Note ? F ACSIMILE : 361 992 3377 ? W EBSITE : WWW.IRCTT.COM
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
O AR SERIES ISSUE J UNE 2011 SHEET 2 OF 3
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
? TT electronics plc
08.13
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