参数资料
型号: OP296HRUZ-REEL
厂商: Analog Devices Inc
文件页数: 15/19页
文件大小: 0K
描述: IC OPAMP DUAL R-R MCRPWR 8-TSSOP
标准包装: 1
放大器类型: 通用
电路数: 2
输出类型: 满摆幅
转换速率: 0.3 V/µs
增益带宽积: 450kHz
电流 - 输入偏压: 10nA
电压 - 输入偏移: 35µV
电流 - 电源: 60µA
电流 - 输出 / 通道: 4mA
电压 - 电源,单路/双路(±): 3 V ~ 12 V,±1.5 V ~ 6 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 标准包装
产品目录页面: 768 (CN2011-ZH PDF)
其它名称: OP296HRUZ-REELDKR
OP196/OP296/OP496
REV.
–5–
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Input Voltage
2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Differential Input Voltage
. . . . . . . . . . . . . . . . . . . . . . . . 15 V
Output Short Circuit Duration . . . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range
S, RU Package . . . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Operating Temperature Range
OP196G, OP296G, OP496G, H . . . . . . . – 40
°C to +125°C
Junction Temperature Range
S, RU Package . . . . . . . . . . . . . . . . . . . – 65
°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300
°C
Package Type
JA
JC
Unit
8-Lead SOIC
158
43
°C/W
8-Lead TSSOP
240
43
°C/W
14-Lead SOIC
120
36
°C/W
14-Lead TSSOP
180
35
°C/W
NOTES
1Absolute maximum ratings apply to
2For supply voltages less than 15 V, the absolute maximum input voltage is
equal to the supply voltage.
3
θ
JA is specified for the worst case conditions
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the OP196/OP296/OP496 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionalit y.
WARNING!
ESD SENSITIVE DEVICE
E
packaged parts, unless otherwise noted.
;
θJA is specified for device soldered in circuit board for SOIC and TSSOP packages.
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