参数资料
型号: OP400HSZ-REEL
厂商: Analog Devices Inc
文件页数: 12/16页
文件大小: 0K
描述: IC OPAMP GP 500KHZ QUAD 16SOIC
标准包装: 1,000
放大器类型: 通用
电路数: 4
转换速率: 0.15 V/µs
增益带宽积: 500kHz
电流 - 输入偏压: 750pA
电压 - 输入偏移: 80µV
电流 - 电源: 600µA
电压 - 电源,单路/双路(±): ±3 V ~ 18 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)
供应商设备封装: 16-SOIC W
包装: 带卷 (TR)
其它名称: OP400HSZ-REEL-ND
OP400HSZ-REELTR
Data Sheet
OP400
Rev. H | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
±20 V
Differential Input Voltage
±30 V
Input Voltage
Supply voltage
Output Short-Circuit Duration
Continuous
Storage Temperature Range
P, Y, S Packages
65°C to +150°C
Lead Temperature (Soldering 60 sec)
300°C
Junction Temperature (TJ) Range
65°C to +150°C
Operating Temperature Range
OP400A
55°C to +125°C
OP400E, OP400F
25°C to +85°C
OP400G
0°C to 70°C
OP400H
40°C to +85°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply to both dice and packaged
parts, unless otherwise noted.
THERMAL RESISTANCE
θJA is specified for worst-case mounting conditions, that is, θJA is
specified for device in socket for CERDIP and PDIP packages;
θJA is specified for device soldered to printed circuit board for
SOIC package.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
14-Pin Ceramic DIP (Y)
94
10
°C/W
14-Pin Plastic DIP (P)
76
33
°C/W
16-Pin SOIC (S)
88
23
°C/W
ESD CAUTION
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