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参数资料
| 型号： | OP490GP |
| 厂商： | ANALOG DEVICES INC |
| 元件分类： | 运动控制电子 |
| 英文描述： | Low Voltage Micropower Quad Operational Amplifier |
| 中文描述： | QUAD OP-AMP, 100 uV OFFSET-MAX, 0.02 MHz BAND WIDTH, PDIP14 |
| 封装： | PLASTIC, DIP-14 |
| 文件页数： | 5/12页 |
| 文件大小： | 241K |
| 代理商： | OP490GP |
OP490
REV. B
–5–
Wafer Test Limts
Parameter
Symbol
Conditions
Limits
Units
Input Offset Voltage
Input Offset Current
Input Bias Current
Large Signal Voltage Gain
V
OS
I
OS
I
B
A
VO
0.75
5
20
mV max
nA max
nA max
V
CM
= 0 V
V
CM
= 0 V
V
S
=
±
15 V, V
O
=
±
10 V
R
L
= 100 k
R
L
= 10 k
V+ = 5 V, V– = 0 V
1 V < V
O
< 4 V, R
L
= 100 k
V+ = 5 V, V– = 0 V
V
S
=
±
15 V
1
V
S
=
±
15 V
R
L
= 10 k
R
L
= 2 k
V+ = 5 V, V– = 0 V
R
L
= 2 k
V+ = 5 V, V– = 0 V
R
L
= 10 k
V+ = 5 V, V– = 0 V, 0 V < V
CM
< 4 V
V
S
=
±
15 V, –15 V < V
CM
< 13.5 V
500
250
125
V/mV min
V/mV min
Input Voltage Range
IVR
0/4
–15/13.5
V min
Output Voltage Swing
V
O
±
13.5
±
10.5
V min
V
OH
4.0
V min
V
OL
500
80
90
10
80
μ
V max
dB min
Common-Mode Rejection
CMR
Power Supply Rejection Ratio
Supply Current (All Amplifiers)
PSRR
I
SY
μ
V/V max
μ
A max
V
S
=
±
15 V, No Load
NOT ES
1
Guaranteed by CMR test.
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
(@ V
S
=
6
1.5 V to
6
15 V, T
A
= +25
8
C, unless otherwse noted)
ABSOLUT E MAX IMUM RAT INGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Differential Input Voltage . . . .[(V–) – 20 V] to [(V+) + 20 V]
Common-Mode Input Voltage .[(V–) – 20 V] to [(V+) + 20 V]
Output Short-Circuit Duration . . . . . . . . . . . . . . .Continuous
Storage T emperature Range
T C, Y, P Package . . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
Operating T emperature Range
OP490A . . . . . . . . . . . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
OP490E, OP490F . . . . . . . . . . . . . . . . . . . –25
°
C to +85
°
C
OP490G . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Junction T emperature (T
J
) . . . . . . . . . . . . . –65
°
C to +150
°
C
Lead T emperature Range (Soldering, 60 sec) . . . . . . +300
°
C
Package T ype
u
JA2
u
JC
Units
14-Pin Hermetic DIP (Y)
14-Pin Plastic DIP (P)
28-Contact LCC (T C)
16-Pin SOL (S)
99
76
78
92
12
33
30
27
°
C/W
°
C/W
°
C/W
°
C/W
NOT ES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
is specified for worst case mounting conditions, i.e.,
θ
is specified for device
in socket for Cerdip, P-DIP, and LCC packages;
θ
JA
is specified for device soldered
to printed circuit board for SOL package.
ORDE RING GUIDE
1
T
A
= +25
8
C
V
OS
max
(mV)
Operating
T emperature
Range
Package
Description
Model
OP490AY
2
OP490AT C/883
OP490EY
OP490FY
OP490GP
OP490GS
3
0.5
0.5
0.5
0.75
1.0
1.0
MIL
MIL
IND
IND
X IND
X IND
14-Pin Cerdip
28-Contact LCC
14-Pin Cerdip
14-Pin Cerdip
14-Pin Plastic DIP
16-Pin SOL
NOT ES
1
Burn-in is available on commercial and industrial temperature range parts in
cerdip, plastic DIP and T O-can packages.
2
For devices processed in total compliance to MIL-ST D-883, add /883 after
part number. Consult factory for 883 data sheet.
3
For availability and burn-in information on SO and PLCC packages, contact
your local sales office.
DICE CHARACT E RIST ICS
Die Size 0.139
×
0.121 inch, 16,819 sq. mils
(3.53
×
3.07 mm, 10.84 sq. mm)
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