参数资料
| 型号： | OPA544TG3 |
| 厂商： | Texas Instruments |
| 文件页数： | 11/11页 |
| 文件大小： | 0K |
| 描述： | IC OPAMP PWR 1.4MHZ SGL TO220-5 |
| 标准包装： | 49 |
| 放大器类型： | 功率 |
| 电路数： | 1 |
| 转换速率： | 8 V/µs |
| 增益带宽积： | 1.4MHz |
| 电流 - 输入偏压： | 15pA |
| 电压 - 输入偏移： | 1000µV |
| 电流 - 电源： | 12mA |
| 电流 - 输出 / 通道： | 4A |
| 电压 - 电源，单路/双路(±)： | 20 V ~ 70 V，±10 V ~ 35 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | TO-220-5 |
| 供应商设备封装： | TO-220-5 |
| 包装： | 管件 |
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
OPA544F
OBSOLETE
DDPAK/
TO-263
KTT
5
TBD
Call TI
OPA544F/500
ACTIVE
DDPAK/
TO-263
KTT
5
500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
OPA544F
OPA544F/500G3
ACTIVE
DDPAK/
TO-263
KTT
5
500
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
OPA544F
OPA544FKTTT
ACTIVE
DDPAK/
TO-263
KTT
5
50
TBD
Call TI
OPA544F
OPA544FKTTTG3
ACTIVE
DDPAK/
TO-263
KTT
5
50
TBD
Call TI
OPA544F
OPA544T
ACTIVE
TO-220
KC
5
49
TBD
Call TI
-40 to 85
OPA544T
OPA544T-1
OBSOLETE
TO-220
KC
5
TBD
Call TI
OPA544TG3
ACTIVE
TO-220
KC
5
49
TBD
Call TI
-40 to 85
OPA544T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
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