参数资料
型号: P08-050HLC-E-G
厂商: 3M
文件页数: 31/32页
文件大小: 0K
描述: CONN HERMAPHROD 50POS .8MM SM
标准包装: 300
系列: P08
连接器类型: 无公形或母形之分,自配接
位置数: 50
间距: 0.031"(0.80mm)
行数: 2
安装类型: 表面贴装
特点: 板导轨,固定焊尾
触点表面涂层:
触点涂层厚度: 8µin(0.20µm)
包装: 管件
配接层叠高度: 11.5mm
板上方高度: 0.329"(8.35mm)
其它名称: 54745216496
JE150310611
RoHS Compliant Statement
“RoHS Compliant 2005/95/EC” means that the product or part
( “Product”) does not contain any of the substances in excess of
the maximum concentration values in EU Directive 2002/95/EC,
as amended by Commission Decision 2005/618/EC, unless the
substance is in an application that is exempt under EU RoHS. This
information represents 3M’s knowledge and belief, which may be
based in whole or in part on information provided by third party
suppliers to 3M.
In the event any Product is proven not to conform with 3M’s RoHS
claim, then 3M’s entire liability and Buyer’s exclusive remedy, will be
at 3M’s option either: (i) replacement of Product with a conforming
product, or (ii) refund of the purchase price paid by Buyer for each
non-conforming Product, within a reasonable time after written
notification of said non-conformance and return of said Product
to 3M. 3M shall not under any circumstances be liable for direct,
INCIDENTAL, SPECIAL, OR CONSEQUENTIAL DAMAGES (INCLUDING BUT NOT
limited to loss of profits, revenue, or business) related to or arising
out of this certification, including, the use, misuse or inability to
use the Product. Unless stated otherwise in writing, the foregoing
language cannot be waived, modified, or supplemented in any
manner whatsoever.
“RoHS Compliant” does not imply high temperature. Please refer
to the specifications to determine suitability for processing.
Backwards Compatibility
3M Electronic Solutions Division RoHS compliant products
have been tested for solderability per J-STD-002 using iNEMI
recommended Sn-Cu and Sn-Ag-Cu solders as well as eutectic
Sn-Pb solders. Based on this test standard, acceptable solderability
has been achieved with all solders tested. RoHS compliant products
will solder with Sn-Pb solders. Before using this product in any
tin-lead solder processes, you must evaluate the product in your
process and determine if it is suitable for your process. You assume
all risks and liability associated with such use. It is NOT advisable
to “drop in” RoHS compliant products to current tin-lead solder
processes without proper evaluation. It may be advisable to perform
pilot runs with the RoHS compliant product to assure that the
process achieves a good solder joint without process modification
or adjustment. Some process adjustment may be necessary.
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