参数资料
| 型号： | P08-100HLTCW-E-G |
| 厂商： | 3M |
| 文件页数： | 6/32页 |
| 文件大小： | 0K |
| 描述： | CONN HERMAPHROD 100POS .8MM SM |
| 产品变化通告： | P08-xxHLTCW-E-G Discontinuation 27/Jan/2006 |
| 标准包装： | 400 |
| 系列： | P08 |
| 连接器类型： | 无公形或母形之分，自配接 |
| 位置数： | 100 |
| 间距： | 0.031"（0.80mm） |
| 行数： | 2 |
| 安装类型： | 表面贴装 |
| 特点： | 板导轨，固定焊尾 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 8µin（0.20µm） |
| 包装： | 带卷 (TR) |
| 配接层叠高度： | 11.5mm |
| 板上方高度： | 0.329"（8.35mm） |
| 其它名称： | 05111162206 XE008018899 |
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3M ? BOARDMOUNT CONNECTOR SOLUTIONS
PRODUCT
PIN STRIP HEADERS
SERIES 95X
BOARDMOUNT PIN STRIPS
AND SOCKETS
2 MM, SERIES 95X
BOX HEADERS
2 MM X 2 MM, SOLDER TAIL
SERIES 957
SOCKETS AND PIN STRIP
HEADERS, .100" X .100"
SERIES 929
POLARIZED BOARDMOUNT
SOCKETS, .100" X .100"
SERIES 5100, 6800, 8500, 9100
SOCKETS AND PIN STRIP
HEADERS, 2 MM X 2 MM
SERIES 15
6
FEATURES
? ROHS COMPLIANT
? Single and Dual Row
? 3 - 80 Positions
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Maximizes Use of PC Board Space
? End Stackable Feature
? Mates with Boardmount and
Wiremount Products
? Available in Straight, Right Angle
Through-Hole and Surfacemount
Versions
? ROHS COMPLIANT
? Maximizes Use of PC Board Space
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Dual Row Design, 4–80 Pins
? Minimized PC Board
Stacking Heights
? Mates With Pin Strip Header
Products
? Available in Straight, Right Angle
Through-Hole, Through-Board and
Surfacemount Versions
? ROHS COMPLIANT
? High Temperature Dielectric
? “No Lead” Wave and Reflow Solder
Compatible
? Maximizes Use of PC Board Space
? Center Slot Polarization
Prevents Mis-Insertions and
Reduces Insertion Time
? 10 - 68 Positions
? ROHS COMPLIANT VERSION AVAILABLE
? 2-72 Positions
? Single- and Dual-Row Options
? Through-Hole and Through-Board
Options
? Customizable Stack Heights
from .150" to 1.325"
? High Temperature Insulator Option
? ROHS COMPLIANT
? 10-64 Positions
? Vertical and Right Angle Options
? Center Bump Polarization
? ROHS COMPLIANT VERSION AVAILABLE
? 4-60 Positions
? Single and Dual-Row Options
? Surfacemount, Through-Hole
and Through-Board Options
? Customizable Stack Heights
from .101" to 1.418"
? High Temperature Insulator
MATERIALS
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[ 100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ’" ] Matte Tin
CONTACT
Material: Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ" ] Matte Tin
CONTACT
Material: Square Pin 0.5 mm,
Copper Alloy
INSULATION
Material: High Temperature
Thermoplastic
Color: Black
FLAMMABILITY UL 94V-0
PLATING
Underplating: 1.25–2.5 μm
[ 100 μ" ] Nickel
Wiping Area: 0.25 μm [ 10 μ" ] Gold
Solder Tail Area: 1–3 μm
[ 40–118 μ" ] Matte Tin
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled Polyester
(PBT) or PCT (RoHS Compliant)
FLAMMABILITY UL 94V-0
PLATING
Pin Strip Underplating: 50 μ"
[ 1.27 μm ] Nickel, Interface: 10 μ"
[ 0.25 μm ] or 30 μ" [ 0.76 μm ] Gold
Socket Underplating: 100 μ"
[ 2.54 mm ] Nickel, Interface: 10 μ"
[ 0.25 μm ] or 30 μ" [ 0.76 μm ] Gold
Tin Plated Versions Available
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled Polyester
FLAMMABILITY UL 94V-0
PLATING
Underplating: 2 μm [ 79 μ" ] Nickel
Wiping Area: 0.3 μm [ 12 μ" ] Gold
CONTACT
Material: Copper Alloy
INSULATION
Material: Glass Filled PCT
FLAMMABILITY UL 94V-0
PLATING
Underplating: 50-150 μ"
[ 1.27-3.81 μm ] Nickel
Wiping Area: 30 μ" [ 0.76 μm ] Gold
PERFORMANCE
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A, 2 A or 2.5 A
TEMPERATURE RATING: -40°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -55°C to +105°C
CURRENT RATING: 1 A
TEMPERATURE RATING: -55°C to +105°C
3M.com/interconnects
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相关代理商/技术参数 |
参数描述 |
|---|---|
| P08-100-PL-A-G | 制造商:3M Electronic Products Division 功能描述:0.8 mm, Vertical, SMT, 100 contact, 2.72mm height, Connector, locking |
| P08-100PL-A-G | 功能描述:板对板与夹层连接器 100POS 0.8MMSOLDERST BRD TO BOARD PL RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| P08-100PL-A-TG | 功能描述:板对板与夹层连接器 .8mm 100P SMT PLUG RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| P08-100-PLC-A-G | 功能描述:板对板与夹层连接器 100P/PAK8/PLG/2.72 PRO/ALNPT/GFL/VAC/TU RoHS:否 制造商:JAE Electronics 系列:WP3 产品类型:Receptacles 节距:0.4 mm 叠放高度:1 mm 安装角: 位置/触点数量:50 排数:2 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:50 V 电流额定值:0.4 A |
| P08-100PLC-A-G | 功能描述:CONN PLUG 100POS .8MM VERT SM RoHS:是 类别:连接器，互连式 >> 板对板 - 阵列，边缘类型，包厢 系列:P08 产品培训模块:Bergstak Overview 产品变化通告:BergStak Mfg Change 29/Oct/2011 Mfg Location Change 10/May/2012 产品目录绘图:61083 Series_140 Positions 特色产品:Bergstak? 0.8mm Mezzanine Connectors 标准包装:1 系列:BergStak®, MezzSelect™ 连接器类型:插头，中央触点带 位置数:140 间距:0.031"（0.80mm） 行数:2 安装类型:表面贴装 特点:板导轨 触点表面涂层:金 触点涂层厚度:8µin（0.20µm） 包装:剪切带 (CT) 配接层叠高度:6mm，10mm，14mm 板上方高度:0.224"（5.70mm） 产品目录页面:139 (CN2011-ZH PDF) 配套产品:609-1647-6-ND - CONN RECEPT 140POS .8MM DUAL SMD609-1643-6-ND - CONN RECEPT 140POS .8MM DUAL SMD61082-141102-ND - CONN RECEPT 140POS .8MM DUAL SMD61082-141022-ND - CONN RECEPT 140POS .8MM DUAL SMD61082-141002-ND - CONN RECEPT 140POS .8MM DUAL SMD61082-141122-ND - CONN RECEPT 140POS .8MM DUAL SMD61082-142122-ND - CONN RECEPT 140POS .8MM DUAL SMD61082-142102-ND - CONN RECEPT 140POS .8MM DUAL SMD61082-142602LF-ND - CONN RECEPT 140POS .8MM DUAL SMD61082-142002-ND - CONN RECEPT 140POS .8MM DUAL SMD更多... 其它名称:609-1709-1 |
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