2
PS8935B
03/26/09
PI3A268C
Small Plastic Package, Dual SPDT Analog Switch with -1.5V Signal
Support for AC Coupled Audio Signals and D-Class Audio Signals
Power Supply
Parameter
Symbol Test Conditions
Min
Typ
Max
Units
Supply Current ICC
VDD = 2.7V, VIN = 0V to VDD
20
μA
VDD = 3.3V, VIN = 0V to VDD
36
μA
VDD = 4.2V, VIN = 0V to VDD
80
μA
Notes:
1.
"Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any
other conditions beyond those indicated in the operational sections of this specication is not implied.
2.
The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed.
3.
Control input must be held HIGH or LOW; it must not oat.
Recommended Operating Conditions(3)
Supply Voltage Operating (VDD) . . . . . . . . . 2.8V to 4.2V ± 5%
Control Input Voltage (VIN) . . . . . . . . . . . . . . . . . . . .0V to VDD
Switch Input Voltage (VINPUT). . . . . . . . . . . . . . . -1.5V to VDD
Operating Temperature (TA) . . . . . . . . . . . . . . . –40°C to +85°C
Input Rise and Fall Time (tr,tf)
Control Input VDD = 2.3V - 3.6V . . . . . . . . 0ns/V to 10ns/V
Thermal Resistance (
JA) . . . . . . . . . . . . . . . . . . . . . . .350°C/W
Lead Temperature (soldering 10s) . . . . . . . . . . . . . . . . . +300°C
Bump Temperature (soldering notes)
Infared (15s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Vapor Phase (60ns) . . . . . . . . . . . . . . . . . . . . . . . . . . +215°C
Absolute Maximum Ratings(1)
Supply Voltage VDD ............................................. 2.5V to 4.6V
DC Control Switch Voltage (VINX) .......................... 0V to 5.0V
DC Input Voltage (VIN)(2) ....................................–1.5V to VDD
Continuous Current NO_NC_COM_ .............................. ±300mA
Peak Current NO_NC_COM_
(pulsed at 1ms 50% duty cycle) ............................... ±400mA
Peak Current NO_NC_COM_
(pulsed at 1ms 10% duty cycle) ............................... ±500mA
Storage Temperature Range (TSTG) .............. –65°C to +150°C
Junction Temperature under Bias (TJ) .............................150°C
Junction Lead Temperature (TL)
(Soldering, 10 seconds) ................................................260°C
09-0056