参数资料
型号: PA28F200BV-B80
厂商: INTEL CORP
元件分类: PROM
英文描述: 2-MBIT SmartVoltage BOOT BLOCK FLASH MEMORY FAMILY
中文描述: 256K X 8 FLASH 5V PROM, 150 ns, PDSO44
封装: 0.525 X 1.110 INCH, PLASTIC, SOP-44
文件页数: 9/48页
文件大小: 562K
代理商: PA28F200BV-B80
28F200BX-T/B, 28F002BX-T/B
1.6 Pin Descriptions for x8 28F002BX
Symbol
Type
Name and Function
A
0
–A
17
I
ADDRESS INPUTS
for memory addresses. Addresses are internally latched during
a write cycle.
A
9
I
ADDRESS INPUT:
When A
9
is at 12V the signature mode is accessed. During this
mode A
0
decodes between the manufacturer and device ID’s.
DATA INPUTS/OUTPUTS:
Inputs array data on the second CE
Y
and WE
Y
cycle
during a program command. Inputs commands to the command user interface
when CE
Y
and WE
Y
are active. Data is internally latched during the write and
program cycles. Outputs array, Intelligent Identifier and status register data. The
data pins float to tri-state when the chip is deselected or the outputs are disabled.
DQ
0
–DQ
7
I/O
CE
Y
I
CHIP ENABLE:
Activates the device’s control logic, input buffers, decoders and
sense amplifiers. CE
Y
is active low; CE
Y
high deselects the memory device and
reduces power consumption to standby levels. If CE
Y
and RP
Y
are high, but not at
a CMOS high level, the standby current will increase due to current flow through the
CE
Y
and RP
Y
input stages.
Y
RP
Y
I
RESET/DEEP POWERDOWN:
Provides Three-State control. Puts the device in
deep powerdown mode. Locks the Boot Block from program/erase.
When RP
Y
is at logic high level and equals 6.5V maximum the Boot Block is locked
and cannot be programmed or erased.
When RP
Y
e
11.4V minimum the Boot Block is unlocked and can be programmed
or erased.
When RP
Y
is at a logic low level the Boot Block is locked, the deep powerdown
mode is enabled and the WSM is reset preventing any blocks from being
programmed or erased, therefore providing data protection during power
transitions. When RP
Y
transitions from logic low to logic high, the flash memory
enters the read-array mode.
OE
Y
I
OUTPUT ENABLE:
Gates the device’s outputs through the data buffers during a
read cycle. OE
Y
is active low.
WE
Y
I
WRITE ENABLE:
Controls writes to the Command Register and array blocks. WE
Y
is active low. Addresses and data are latched on the rising edge of the WE
Y
pulse.
V
PP
PROGRAM/ERASE POWER SUPPLY:
For erasing memory array blocks or
programming data in each block.
Note:
V
PP
k
V
PPLMAX
memory contents cannot be altered.
DEVICE POWER SUPPLY (5V
g
10%, 5V
g
5%)
GROUND:
For all internal circuitry.
V
CC
GND
NC
NO CONNECT:
Pin may be driven or left floating.
DU
DON’T USE PIN:
Pin should not be connected to anything.
9
相关PDF资料
PDF描述
PA28F200BX-T60 2-MBIT (128K x 16, 256K x 8) BOOT BLOCK FLASH MEMORY FAMILY
PA28F200BVT120 2-MBIT SmartVoltage BOOT BLOCK FLASH MEMORY FAMILY
PA28F200BVT60 2-MBIT SmartVoltage BOOT BLOCK FLASH MEMORY FAMILY
PA28F400BX-B120 4-MBIT (256K X 16, 512K X 8) BOOT BLOCK FLASH MEMORY FAMILY
PA28F400BX-B60 LENS, ROUND, RED; Colour:Red; Diameter, external:29mm RoHS Compliant: Yes
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