参数资料
型号: PACDN1404CG
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: 4 CH. ESD PROTECTION WLCSP
标准包装: 3,500
电压 - 反向隔离(标准值): 5.5V
电压 - 击穿: 5.6V
电极标记: 4 通道阵列 - 单向
安装类型: 表面贴装
封装/外壳: 6-WFBGA,WLCSP
供应商设备封装: 6-WLCSP(1.8x1.15)
包装: 带卷 (TR)
PACDN1404
ESD Protection Arrays in
Chip Scale Package
Product Description
The PACDN1404 and PACDN1408 are 4 ? and 8 ? channel transient
voltage suppressor arrays that provide a very high level of protection
for sensitive electronic components that may be subjected to ESD.
These devices are designed and characterized to safely dissipate
ESD strikes at levels well beyond the maximum requirements set forth
http://onsemi.com
in the IEC 61000 ? 4 ? 2 international standard (Level 4, ? 8 kV contact
discharge). All I/Os are rated at ? 25 kV using the IEC 61000 ? 4 ? 2
contact discharge method. Using the MIL ? STD ? 883D (Method 3015)
specification for Human Body Model (HBM) ESD, all pins are
WLCSP6
CG SUFFIX
CASE 567BD
WLCSP10
CG SUFFIX
CASE 567BM
protected for contact discharges to greater than ? 30 kV.
The Chip Scale Package format of these devices provide extremely
ELECTRICAL SCHEMATIC
small footprints that are necessary in portable electronics such as
cellular phones, PDAs, internet appliances and PCs. The large solder
B1
B2
B3
bumps allow for standard attachments to laminate boards without the
use of underfill. The PACDN1404 and PACDN1408 are packaged in
RoHS ? compliant, lead ? free finishing.
Features
? Four or Eight Transient Voltage Suppressors in a Single Package
? In ? System Electrostatic Discharge (ESD) Protection to ? 25 kV
Contact Discharge per IEC 61000 ? 4 ? 2 International Standard
? Compact Chip Scale Package (CSP) in a 0.65 mm Pitch Format
Saves Board Space and Eases Layout in Space Critical
B1
A1
A2
PACDN1404
B2 B3 B4
A3
B5
Applications Compared to Discrete Solutions and Traditional Wire
Bonded Packages
?
?
6 ? and 10 ? Bump WLCSPs
These Devices are Pb ? Free and are RoHS Compliant
A1
A2 A3 A4
PACDN1408
A5
Applications
? ESD Protection for Sensitive Electronic Equipment
MARKING DIAGRAM
? I/O Port, Keypad and Button Circuitry Protection for Portable
Devices
? Wireless Handsets
?
Handheld PCs / PDAs
D14
DN1408
?
?
?
?
MP3 Players
Digital Cameras and Camcorders
Notebooks
Desktop PCs
D14 = PACDN1404CG
DN1408 = PACDN1408CG
ORDERING INFORMATION
Device
PACDN1404CG
PACDN1408CG
Package
WLCSP6
(Pb ? Free)
WLCSP10
Shipping ?
3500/Tape & Reel
3500/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 4
1
Publication Order Number:
PACDN1404/D
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相关代理商/技术参数
参数描述
PACDN1404CR 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE
PACDN1408C 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, 8 CHANNEL, CHIP SCALE PACKAGE
PACDN1408CG 功能描述:TVS二极管阵列 8CH TRANSIENT VOLT SUPPRESOR ARRAY RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C
PACDN1408CR 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, 8 CHANNEL, CHIP SCALE PACKAGE
PACDN1416C 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE