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参数资料
| 型号： | PACDN1408CG |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/5页 |
| 文件大小： | 0K |
| 描述： | 8 CH. ESD PROTECTION WLCSP10 |
| 标准包装： | 3,500 |
| 电压 - 反向隔离（标准值）： | 5.5V |
| 电压 - 击穿： | 5.6V |
| 电极标记： | 8 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFBGA，CSPBGA |
| 供应商设备封装： | 10-CSP（1.8x1.15） |
| 包装： | 带卷 (TR) |
PACDN1404
APPLICATION INFORMATION
Parameter
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser Cut, 5% Tapered Walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance ? Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183 ? C)
Maximum Soldering Temperature for Lead ? free Devices Using a Lead ? free Solder Paste
Value
0.240 mm
Round
Non ? Solder Mask Defined Pads
0.290 mm Round
0.125 mm ? 0.150 mm
0.300 mm Round
50/50 by Volume
No Clean
OSP (Entek Cu Plus 106A)
? 50 m m
? 20 m m
60 seconds
260 ? C
Non ? Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 1. Recommended Non ? Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0 3:00.0
4:00.0
Time (minutes)
Figure 2. Lead ? free (SnAgCu) Solder Ball Reflow Profile
http://onsemi.com
3
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PACDN1408CR | 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, 8 CHANNEL, CHIP SCALE PACKAGE |
| PACDN1416C | 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN1416CR | 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN2404C | 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
| PACDN2404CR | 制造商:CALMIRCO 制造商全称:California Micro Devices Corp 功能描述:ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE |
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