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参数资料
| 型号： | PAD.25 |
| 厂商： | Taoglas Limited |
| 文件页数： | 20/21页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD FOR PA.25 |
| 标准包装： | 1 |
| 类型： | 天线 |
| 频率： | 824MHz ~ 960MHz，1.7GHz ~ 2.17GHz |
| 适用于相关产品： | PA.25 |
| 已供物品： | 板 |
| 其它名称： | 931-1133 |
7. Recommended Reflow Temperature Profile
The PA.25 can be assembled following either Sn-Pb or Pb-Free assembly processes.
The recommended soldering temperatures are as follows:
Phase
Ramp-Up
Preheat
Reflow
Peak
Ramp-Down
Profile Features
Avg Ramp-Up Rate
(Tsmax to Tp)
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Temperature (T L )
Total Time Above T L b(t L )
Temperature (Tp)
Time (tp)
Rate
Sn-Pb Assembly
3°C/second (max)
100°C
150°C
60-120 seconds
183°C
60-150 seconds
235°C
10-30 seconds
6°C/second (max)
Pb-Free Assembly
(SnAgCu)
3°C/second (max)
150°C
200°C
60-120 seconds
217°C
60-150 seconds
260°C
20-40 seconds
6°C/second (max)
Time from 25°C to peak Temperature
T p
6 minutes max
tp
Ramp-up
8 minutes max
Critical Zone T L to T p
T L
Ts max
Ts min
ts Preheat
Ramp-down
25°
t 25°C to Peak
Time
Temperature profile – (green area) for the assembly process in reflow ovens
SPE-11-8-061/G | page 20 of 21
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