参数资料
型号: PC33887VW
厂商: Motorola, Inc.
英文描述: 5.0 A H-Bridge with Load Current Feedback
中文描述: 5.0的H -桥的负载电流反馈
文件页数: 5/28页
文件大小: 485K
代理商: PC33887VW
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33887
5
PGND
PGND
NC
V+
V+
V+
V+
NC
NC
NC
NC
C
D1
IN2
EN
NC
NC
NC
NC
D2
NC
OUT2
OUT2
OUT2
OUT2
PGND
PGND
PGND
PGND
NC
V+
V+
V+
V+
NC
NC
NC
NC
IN1
FS
AGND
NC
NC
NC
NC
NC
FB
NC
OUT1
OUT1
OUT1
OUT1
PGND
PGND
54
53
52
40
39
38
37
36
.35
34
33
32
31
30
29
28
47
46
45
44
43
42
41
51
50
49
48
1
2
3
15
16
17
18
19
20
21
22
23
24
25
26
27
8
9
10
11
12
13
14
4
5
6
7
Transparent Top View of Package
SOICW-EP TERMINAL DEFINITIONS
A functional description of each terminal can be found in the System/Application Information section,
page 19
.
Terminal
Terminal
Name
Formal Name
Definition
1–4, 51–54
PGND
Power Ground
High-current power ground.
5–7, 9, 14, 19–22,
27–29, 33–36, 41,
46, 48–50
NC
No Connect
No internal connection to this terminal.
8
D2
Disable 2
Active LOW input used to simultaneously tri-state disable both H-Bridge
outputs. When D2 is Logic LOW, both outputs are tri-stated.
10–13
OUT2
H-Bridge Output 2
Output 2 of H-Bridge.
15–18, 37–40
V+
Positive Power Supply
Positive supply connections.
23
C
CP
Charge Pump Capacitor
External reservoir capacitor connection for internal charge pump capacitor.
24
D1
Disable 1
Active HIGH input used to simultaneously tri-state disable both H-Bridge
outputs. When D1 is Logic HIGH, both outputs are tri-stated.
25
IN2
Logic Input Control 2
Logic input control of OUT2 (i.e., IN2 logic HIGH = OUT2 HIGH).
26
EN
Enable
Logic input Enable control of device (i.e., EN logic HIGH = full operation,
EN logic LOW = Sleep Mode).
30
AGND
Analog Ground
Low-current analog signal ground.
31
FS
Fault Status for H-Bridge
Open drain active LOW Fault Status output requiring a pullup resistor to
5.0 V.
32
IN1
Logic Input Control 1
Logic input control of OUT1 (i.e., IN1 logic HIGH = OUT1 HIGH).
42–45
OUT1
H-Bridge Output 1
Output 1 of H-Bridge.
47
FB
Feedback for H-Bridge
Current feedback output providing ground referenced 1/375th ratio of
H-Bridge high-side current.
Pad
Thermal
Interface
Exposed Pad Thermal
Interface
Exposed pad thermal interface for sinking heat from the device.
Note
Must be DC-coupled to analog ground and power ground via very low
impedance path to prevent injection of spurious signals into IC substrate.
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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