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| 型号： | PC33887VWR2 |
| 厂商： | Motorola, Inc. |
| 英文描述： | 5.0 A H-Bridge with Load Current Feedback |
| 中文描述： | 5.0的H -桥的负载电流反馈 |
| 文件页数： | 7/28页 |
| 文件大小： | 485K |
| 代理商： | PC33887VWR2 |
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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33887
7
THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS
(Note 8)
,
(Note 9)
,
(Note 10)
,
(Note 11)
Junction-to-Board (Bottom Exposed Pad Soldered to Board)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JB
~5.0
~4.3
~8.0
°
C/W
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)
(Note 12)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JA
~41
~TBD
~62
°
C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
(Note 13)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JMA
~30
~21.3
~TBD
°
C/W
Junction-to-Case (Exposed Pad)
(Note 14)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
R
θ
JC
~0.5
~0.9
~1.5
°
C/W
Notes
8.
9.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual R
θ
JB
(junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness. Maximum current at maximum die temperature
represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R
θ
JC
-total must be less than 5.0 °C/W
for maximum load at 70°C ambient. Module thermal design must be planned accordingly.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Indicates the average thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL SPEC-
883 Method 1012.1) with the cold plate temperature used for the case temperature.
10.
11.
12.
13.
14.
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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