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参数资料
| 型号： | PCA24S08AD,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 20/24页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 8KBIT 400KHZ 8SOIC |
| 标准包装： | 2,500 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 8K (1K x 8) |
| 速度： | 400kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 2.5 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
NXP Semiconductors
PCA24S08A
1024 × 8-bit CMOS EEPROM with access protection
12.4 Reflow soldering
Key characteristics in reflow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 15 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Table 10.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature ( ° C)
Volume (mm 3 )
< 350
≥ 350
< 2.5
≥ 2.5
Table 11.
235
220
Lead-free process (from J-STD-020C)
220
220
Package thickness (mm)
Package reflow temperature ( ° C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 15 .
PCA24S08A_1
? NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 19 January 2010
20 of 24
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA24S08ADP | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1024 x 8-bit CMOS EEPROM with access protection |
| PCA24S08ADP,118 | 功能描述:电可擦除可编程只读存储器 CMOS 电可擦除可编程只读存储器 W/ACCESS PROTECTION RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| PCA24S08D | 功能描述:电可擦除可编程只读存储器 1024X8 CMOS 电可擦除可编程只读存储器 ACCESS PROT RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| PCA24S08D,112 | 功能描述:电可擦除可编程只读存储器 1024X8 CMOS 电可擦除可编程只读存储器 RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| PCA24S08D,118 | 功能描述:电可擦除可编程只读存储器 1024X8 CMOS 电可擦除可编程只读存储器 RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
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