参数资料
型号: PCA24S08D,118
厂商: NXP Semiconductors
文件页数: 19/25页
文件大小: 0K
描述: IC EEPROM 8KBIT 400KHZ 8SOIC
标准包装: 2,500
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 8K (1K x 8)
速度: 400kHz
接口: I²C,2 线串口
电源电压: 2.5 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
其它名称: 935276119118
PCA24S08D-T
PCA24S08D-T-ND
NXP Semiconductors
PCA24S08
1024 × 8-bit CMOS EEPROM with access protection
12. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
12.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
12.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
? Through-hole components
? Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
?
?
?
?
?
?
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
12.3 Wave soldering
Key characteristics in wave soldering are:
? Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath specifications, including temperature and impurities
PCA24S08_2
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 11 May 2010
? NXP B.V. 2010. All rights reserved.
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相关代理商/技术参数
参数描述
PCA24S08DP 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1024 ?8-bit CMOS EEPROM with access protection
PCA24S08DP,118 功能描述:电可擦除可编程只读存储器 1024X8 CMOS 电可擦除可编程只读存储器 RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8
PCA24S08DP-T 功能描述:电可擦除可编程只读存储器 1024X8 CMOS 电可擦除可编程只读存储器 ACCESS PROT RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8
PCA24S08D-T 功能描述:电可擦除可编程只读存储器 1024X8 CMOS 电可擦除可编程只读存储器 ACCESS PROT RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8
PCA29-B 制造商:Alpha 3 Manufacturing 功能描述: