参数资料
| 型号： | PCA9500D,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 14/26页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16SOIC |
| 标准包装： | 48 |
| 接口： | I²C，SM 总线 |
| 输入/输出数： | 8 |
| 中断输出： | 无 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.5 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SO |
| 包装： | 管件 |
| 包括： | EEPROM，POR |
| 产品目录页面： | 824 (CN2011-ZH PDF) |
| 其它名称： | 568-1024-5 935271533112 PCA9500D |
PCA9500_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 15 April 2009
21 of 26
NXP Semiconductors
PCA9500
8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
相关PDF资料 |
PDF描述 |
|---|---|
| PCA9535HF,118 | IC I/O EXPANDER I2C 16B 24HWQFN |
| PCA9535CHF,118 | IC I/O EXPANDER I2C 16B 24HWQFN |
| PCA9500PW,118 | IC I/O EXPANDER I2C 8B 16TSSOP |
| PCA9674D,518 | IC I/O EXPANDER I2C 8B 16SOIC |
| PCA9674AD,518 | IC I/O EXPANDER I2C 8B 16SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9500PW | 功能描述:接口-I/O扩展器 I/O EXPANDER W/2K EE RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9500PW,112 | 功能描述:接口-I/O扩展器 I/O EXPANDER W/2K EE RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9500PW,118 | 功能描述:接口-I/O扩展器 8BIT I2C FMQB GPIO PU2K EEPROM RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9500PW,118-CUT TAPE | 制造商:NXP 功能描述:PCA9500 Series 8-Bit I2C and SMBus I/O Port with 2-kbit EEPROM - TSSOP - 16 |
| PCA9500PW112 | 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 8BIT 400KHZ TSSOP-16 |
发布紧急采购，3分钟左右您将得到回复。