参数资料
| 型号： | PCA9501D,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 16/28页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 20SOIC |
| 产品培训模块： | I²C Bus Fundamentals |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 1 |
| 接口： | I²C，SM 总线 |
| 输入/输出数： | 8 |
| 中断输出： | 是 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.5 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 20-SO |
| 包装： | 标准包装 |
| 包括： | EEPROM |
| 其它名称： | 568-5923-6 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页当前第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
PCA9501_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 10 February 2009
23 of 28
NXP Semiconductors
PCA9501
8-bit I2C-bus and SMBus I/O port with interrupt, 2-kbit EEPROM
14.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 29) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 8 and 9
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 29.
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相关PDF资料 |
PDF描述 |
|---|---|
| ATTINY44A-CCUR | MCU AVR 4KB FLASH 20MHZ 15UFBGA |
| 2-583717-7 | CONN CARD EDGE 14POS .100 PCB |
| ATTINY2313A-SUR | MCU AVR 2KB FLASH 20MHZ 20SOIC |
| ATTINY24A-MFR | MCU AVR 2KB FLASH 20MHZ 20QFN |
| PCA9575PW2,118 | IC I2C/SMBUS 16BIT GPIO 28TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9501PW | 功能描述:I2C 接口集成电路 I/O EXPANDER W/2K EE RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| PCA9501PW,112 | 功能描述:I2C 接口集成电路 I/O EXPANDER W/2K EE RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| PCA9501PW,118 | 功能描述:接口-I/O扩展器 8BIT I2C RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9501PW112 | 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 8BIT 400KHZ TSSOP-20 |
| PCA9501PW118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
发布紧急采购，3分钟左右您将得到回复。