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| 型号： | PCA9534PW/DG,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 14/25页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C/SMBU 16TSSOP |
| 标准包装： | 2,500 |
| 系列： | * |
PCA9534_3
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 03 — 6 November 2006
21 of 25
NXP Semiconductors
PCA9534
8-bit I2C-bus and SMBus low power I/O port with interrupt
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
14.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 23) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 12 and 13
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 23.
Table 12.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 13.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9534PWG4 | 功能描述:接口-I/O扩展器 Rem 8B I2C & Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9534PWR | 功能描述:接口-I/O扩展器 Remote 8B I2C & Lo- Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9534PWRG4 | 功能描述:接口-I/O扩展器 Remote 8B I2C & Lo- Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9534RGTR | 制造商:TI 制造商全称:Texas Instruments 功能描述:REMOTE 8-BIT I2C AND SMBus LOW-POWER I/O EXPANDER WITH INTERRUPT OUTPUT AND CONFIGURATION REGISTERS |
| PCA9534RGVR | 功能描述:接口-I/O扩展器 Remote 8B I2C & Lo- Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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