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参数资料
| 型号： | PCA9552D,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 24/28页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER BLINKER 24-SOIC |
| 标准包装： | 1,000 |
| 拓扑： | 开路漏极，PWM |
| 输出数： | 16 |
| 内部驱动器： | 是 |
| 类型 - 主要： | LED 闪烁器 |
| 频率： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SO |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
| 其它名称： | 935272395118 PCA9552D-T PCA9552D-T-ND |
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Philips Semiconductors
PCA9552
16-bit I 2 C-bus LED driver with programmable blink rates
? Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
? For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
? For packages with leads on four sides, the footprint must be placed at a 45 ° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be ?xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 ° C
or 265 ° C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ?ux will eliminate the need for removal of corrosive residues in most
applications.
15.4 Manual soldering
Fix the component by ?rst soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the ?at part of the lead. Contact time must be
limited to 10 seconds at up to 300 ° C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 ° C and 320 ° C.
15.5 Package related soldering information
Table 15:
Package [1]
Suitability of surface mount IC packages for wave and re?ow soldering methods
Soldering method
Wave
Re?ow [2]
BGA,
HTSSON..T [3] ,
LBGA, LFBGA, SQFP,
not suitable
suitable
SSOP..T [3] , TFBGA, VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC [5] , SO, SOJ
not suitable [4]
suitable
suitable
suitable
LQFP, QFP, TQFP
not
recommended [5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended [7]
suitable
CWQCCN..L [8] ,
PMFP [9] ,
WQCCN..L [8]
not suitable
not suitable
PCA9552_5
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales of?ce.
? Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 9 March 2006
24 of 28
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| PCA9553DP/01,118 | IC LED DRIVER LINEAR 8-TSSOP |
| PCA9624PW,118 | IC LED DRIVER RGBA 24-TSSOP |
| PCA9625D/S911,518 | IC LED DRIVER RGBA 32-SOIC |
| PCA9626BS,518 | IC LED DRIVER RGBA 48HVQFN |
| PCA9632DP2,118 | IC LED DRIVER RGBA 10-TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9552PW | 功能描述:LED照明驱动器 I2C LED BLNKER 16BIT RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9552PW,112 | 功能描述:LED照明驱动器 I2C LED BLNKER 16BIT RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9552PW,118 | 功能描述:LED照明驱动器 16-BIT I2C FM OD LED BLK RST RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N |
| PCA9552PW118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| PCA9553 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-bit I2C LED driver with programmable blink rates |
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