参数资料
| 型号： | PCA9554ATS,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 16/35页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 20SSOP |
| 标准包装： | 1 |
| 接口： | I²C，SM 总线 |
| 输入/输出数： | 8 |
| 中断输出： | 是 |
| 频率 - 时钟： | 400kHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-LSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 20-SSOP |
| 包装： | 标准包装 |
| 包括： | POR |
| 产品目录页面： | 826 (CN2011-ZH PDF) |
| 配用： | 568-4002-ND - DEMO BOARD I2C |
| 其它名称： | 568-2024-6 |
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PCA9554_9554A
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 9 — 19 March 2013
23 of 35
NXP Semiconductors
PCA9554; PCA9554A
8-bit I2C-bus and SMBus I/O port with interrupt
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 23) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 23.
Table 12.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 13.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相关PDF资料 |
PDF描述 |
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| PCA9507D,112 | IC I/O EXPANDER I2C 24B 8SOIC |
| PCA9554ABS3,118 | IC I/O EXPANDER I2C 8B 16HVQFN |
| PCA9554BS3,118 | IC I/O EXPANDER I2C 8B 16HVQFN |
| PCA9557D,118 | IC I/O EXPANDER I2C 8B 16SOIC |
| PCA9557PW,112 | IC I/O EXPANDER I2C 8B 16TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9554ATS-T | 功能描述:I2C 接口集成电路 I2C I/O EXPANDER GP RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| PCA9554B | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt, weak pull-up |
| PCA9554BBS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt, weak pull-up |
| PCA9554BBSHP | 功能描述:接口-I/O扩展器 8b I2C/SMBus IO Port I2C Fixed Address RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9554BPW | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Low-voltage 8-bit I2C-bus and SMBus low power I/O port with interrupt, weak pull-up |
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