参数资料
| 型号： | PCA9673DB,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 21/33页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 16B 24SSOP |
| 标准包装： | 1,000 |
| 接口： | I²C |
| 输入/输出数： | 16 |
| 中断输出： | 是 |
| 频率 - 时钟： | 1MHz |
| 电源电压： | 2.3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 24-SSOP |
| 包装： | 带卷 (TR) |
| 包括： | POR |
| 其它名称： | 935283556118 PCA9673DB-T PCA9673DB-T-ND |
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PCA9673
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 29 September 2011
28 of 33
NXP Semiconductors
PCA9673
Remote 16-bit I/O expander for Fm+ I2C-bus with interrupt and reset
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 30.
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相关PDF资料 |
PDF描述 |
|---|---|
| PCA9671DB,118 | IC I/O EXPANDER I2C 16B 24SSOP |
| PCA9675D,118 | IC I/O EXPANDER I2C 16B 24SOIC |
| PCA9673PW,112 | IC I/O EXPANDER I2C 16B 24TSSOP |
| PCA9671PW,112 | IC I/O EXPANDER I2C 16B 24TSSOP |
| PCA9675PW,118 | IC I/O EXPANDER I2C 16B 24TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCA9673DB-T | 功能描述:接口-I/O扩展器 16BIT I2C FM+ QBGPIO INT-RS PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9673DK,118 | 功能描述:接口-I/O扩展器 16BIT I2C FM+ QBGPIO RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9673DK-T | 功能描述:接口-I/O扩展器 16BIT I2C FM+ QBGPIO INT-RS PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9673D-T | 功能描述:接口-I/O扩展器 16BIT I2C FM+ QBGPIO INT-RS PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCA9673PW | 功能描述:接口-I/O扩展器 16BIT I2C FM+ QBGPIO INT-RS PU RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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