参数资料
型号: PCA9922PW,118
厂商: NXP Semiconductors
文件页数: 22/27页
文件大小: 0K
描述: IC LED DRIVER LINEAR 16-TSSOP
产品培训模块: LED Controllers
标准包装: 1
恒定电流:
输出数: 8
内部驱动器:
类型 - 主要: 通用
类型 - 次要: 颜色
频率: 25MHz
电源电压: 3.3 V ~ 5.5 V
输出电压: 5.5V
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 标准包装
工作温度: -40°C ~ 85°C
产品目录页面: 845 (CN2011-ZH PDF)
其它名称: 568-4775-6
NXP Semiconductors
PCA9922
8-channel constant current LED driver with output error detection
? Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 18 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 11 and 12
Table 11.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature ( ° C)
Volume (mm 3 )
< 350
≥ 350
< 2.5
≥ 2.5
Table 12.
235
220
Lead-free process (from J-STD-020C)
220
220
Package thickness (mm)
Package reflow temperature ( ° C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 18 .
PCA9922
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 6 April 2011
? NXP B.V. 2011. All rights reserved.
22 of 27
相关PDF资料
PDF描述
PCA9955TW,118 IC LED DRVR CONST CURR
PCF85102C-2P/03,11 IC EEPROM 2KBIT 100KHZ 8DIP
PCF85103C-2T/00,11 IC EEPROM 2KBIT 100KHZ 8SOIC
PCF8570T/F5,512 IC SRAM 2KBIT 100KHZ 8SOIC
PCF8582C-2T/03,118 IC EEPROM 2KBIT 100KHZ 8SOIC
相关代理商/技术参数
参数描述
PCA9952TW,118 功能描述:LED照明驱动器 16-ch Fm+ I2C-bus 57 mA LED driver RoHS:否 制造商:STMicroelectronics 输入电压:11.5 V to 23 V 工作频率: 最大电源电流:1.7 mA 输出电流: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:SO-16N
PCA9952TW/Q900,118 制造商:NXP Semiconductors 功能描述: 制造商:NXP Semiconductors 功能描述:IC LED DVR 16CH I2C CC 28HTSSOP 制造商:NXP Semiconductors 功能描述:LED Lighting Drivers 16-channel Fm+ I2C- bus 57 mA LED driver
PCA9955ATW/Q900J 功能描述:LED 驱动器 IC 16 输出 线性 I2C 调光 57mA 28-HTSSOP 制造商:nxp semiconductors 系列:汽车级,AEC-Q100 包装:剪切带(CT) 零件状态:过期 类型:线性 拓扑:- 内部开关:是 输出数:16 电压 - 供电(最低):3V 电压 -?供电(最高):5.5V 电压 - 输出:20V 电流 - 输出/通道:57mA 频率:8MHz 调光:I2C 应用:背光 工作温度:-40°C ~ 85°C(TA) 安装类型:表面贴装 封装/外壳:28-SOIC(0.173",4.40mm 宽)裸露焊盘 供应商器件封装:28-HTSSOP 标准包装:1
PCA9955ATWJ 功能描述:LED 驱动器 IC 16 输出 线性 I2C 调光 57mA 28-HTSSOP 制造商:nxp semiconductors 系列:- 包装:剪切带(CT) 零件状态:过期 类型:线性 拓扑:- 内部开关:是 输出数:16 电压 - 供电(最低):3V 电压 -?供电(最高):5.5V 电压 - 输出:20V 电流 - 输出/通道:57mA 频率:8MHz 调光:I2C 应用:背光 工作温度:-40°C ~ 85°C(TA) 安装类型:表面贴装 封装/外壳:28-SOIC(0.173",4.40mm 宽)裸露焊盘 供应商器件封装:28-HTSSOP 标准包装:1
PCA9955BTW/Q900J 功能描述:LED 驱动器 IC 16 输出 线性 65mA 28-HTSSOP 制造商:nxp semiconductors 系列:- 包装:剪切带(CT) 零件状态:有效 类型:线性 拓扑:- 内部开关:是 输出数:16 电压 - 供电(最低):3V 电压 -?供电(最高):5.5V 电压 - 输出:- 电流 - 输出/通道:65mA 频率:- 调光:- 应用:汽车级,背光 工作温度:-40°C ~ 85°C(TA) 安装类型:表面贴装 封装/外壳:28-SOIC(0.173",4.40mm 宽)裸露焊盘 供应商器件封装:28-HTSSOP 标准包装:1