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参数资料
| 型号： | PCF1175CT/F2,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 15/20页 |
| 文件大小： | 0K |
| 描述： | IC LCD CAR CLOCK 4DIG 28-SOIC |
| 标准包装： | 1,000 |
| 显示器类型： | LCD |
| 配置： | 7 段显示 |
| 数字或字符： | 4 位数字 |
| 电流 - 电源： | 950µA |
| 电源电压： | 3 V ~ 6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 28-SO |
| 包装： | 带卷 (TR) |
| 其它名称： | 935074810118 PCF1175CT/F2-T PCF1175CT/F2-T-ND |
Philips Semiconductors
4-digit duplex LCD car clock
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Re?ow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 ° C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 ° C.
1997 Apr 16
15
Product speci?cation
PCF1175C
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
? A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
? The longitudinal axis of the package footprint must be
parallel to the solder flow.
? The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 ° C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 ° C within
6 seconds. Typical dwell time is 4 seconds at 250 ° C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 ° C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 ° C.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCF1175CU | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-digit duplex LCD car clock |
| PCF1175CU/10 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-digit duplex LCD car clock |
| PCF1178C | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-digit duplex LCD car clock |
| PCF1178CT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:4-digit duplex LCD car clock |
| PCF1178CT,112 | 功能描述:LCD 驱动器 4 DIG DUPLX LCD CLCK RoHS:否 制造商:Maxim Integrated 数位数量:4.5 片段数量:30 最大时钟频率:19 KHz 工作电源电压:3 V to 3.6 V 最大工作温度:+ 85 C 最小工作温度:- 20 C 封装 / 箱体:PDIP-40 封装:Tube |
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