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参数资料
| 型号： | PCF8574TS/3,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 14/24页 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 20SSOP |
| 产品培训模块： | I²C Bus Fundamentals |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 75 |
| 接口： | I²C |
| 输入/输出数： | 8 |
| 中断输出： | 是 |
| 频率 - 时钟： | 100kHz |
| 电源电压： | 2.5 V ~ 6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-LSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 20-SSOP |
| 包装： | 管件 |
| 包括： | POR |
| 产品目录页面： | 827 (CN2011-ZH PDF) |
| 配用： | 568-3615-ND - DEMO BOARD I2C |
| 其它名称： | 568-3988-5 935275672112 PCF8574TDK PCF8574TDK-ND |
2002 Nov 22
21
Philips Semiconductors
Product specication
Remote 8-bit I/O expander for I2C-bus
PCF8574
13.4
Suitability of IC packages for wave, reow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable(3)
suitable
Surface mount
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(5)(6) suitable
SSOP, TSSOP, VSO
not recommended(7)
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| PCF8574AP,112 | IC I/O EXPANDER I2C 8B 16DIP |
| PCF8574AT/3,512 | IC I/O EXPANDER I2C 8B 16SOIC |
| PCF8574P,112 | IC I/O EXPANDER I2C 8B 16DIP |
| PCF8574T/3,512 | IC I/O EXPANDER I2C 8B 16SOIC |
| PCA9554PW/DG,118 | IC I/O EXPANDER I2C 8B 16TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCF8575 | 制造商:TI 制造商全称:Texas Instruments 功能描述:REMOTE 16-BIT I2C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT |
| PCF8575C | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Remote 16-bit I/O expander for I2C-bus |
| PCF8575CDB | 功能描述:接口-I/O扩展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCF8575CDBE4 | 功能描述:接口-I/O扩展器 Remote 16-Bit I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| PCF8575CDBG4 | 功能描述:接口-I/O扩展器 Rem 16B I2C & SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
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