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参数资料
| 型号： | PCF8594C-2T/02,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 17/21页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 4KBIT 100KHZ 8SOIC |
| 产品培训模块： | I²C Bus Fundamentals |
| 特色产品： | NXP - I2C Interface |
| 标准包装： | 100 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 4K (512 x 8) |
| 速度： | 100kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 2.5 V ~ 6.0 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 管件 |
| 产品目录页面： | 827 (CN2011-ZH PDF) |
| 其它名称： | 568-3638-5 935195550112 PCF8594C2D |
Philips Semiconductors
PCF8594C-2
512 × 8-bit CMOS EEPROM with I 2 C-bus interface
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm 3 so called
thick/large packages.
? below 240 ° C (SnPb process) or below 260 ° C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
9397 750 14221
15.3.2
15.3.3
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was speci?cally
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
? Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
? For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
? For packages with leads on four sides, the footprint must be placed at a 45 ° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be ?xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 ° C or
265 ° C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ?ux will eliminate the need for removal of corrosive residues in
most applications.
Manual soldering
Fix the component by ?rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the ?at part of the lead. Contact time
must be limited to 10 seconds at up to 300 ° C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 ° C.
? Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data
Rev. 05 — 25 October 2004
17 of 21
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PCF8594E2D | 制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM |
| PCF8594E2N | 制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM |
| PCF8594P | 制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM |
| PCF8594T | 制造商:未知厂家 制造商全称:未知厂家 功能描述:I2C Serial EEPROM |
| PCF8598C-2 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:256 to 1024 x 8-bit CMOS EEPROMs with I2C-bus interface |
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